Plasma induced flow electrode structure, plasma induced flow generation device, and method of manufacturing plasma induced flow electrode structure
In one embodiment, a plasma induced flow electrode structure has an electrode block, an insulating layer and an electrode layer. The electrode block has first and second surfaces and through holes penetrating between these first and second surfaces. The insulating layer is disposed on the first surface and inside the through holes. The electrode layer is disposed on the insulating layer of the first surface.
1. A plasma induced flow electrode structure comprising:
an electrode block including a first and a second surface and a plurality of through holes penetrating between the first and second surfaces;
an insulating layer disposed on the first surface and inside the through holes; and
an electrode layer disposed on the insulating layer on the first surface.
2. The plasma induced flow electrode structure of claim 1 ,
wherein the electrode layer extends onto the insulating layer inside the through holes.
3. The plasma induced flow electrode structure of claim 1 ,
wherein the electrode layer is not disposed in a part of first areas on the first surface and around the through holes.
4. The plasma induced flow electrode structure of claim 3 , further comprising
a second electrode layer disposed in a part of second areas on the second surface and around the through holes.
5. The plasma induced flow electrode structure of claim 1 , further comprising
an insulating plate disposed between the insulating layer and the electrode layer, the insulating plate including third and fourth surfaces and a plurality of second through holes, the second through holes penetrating between the third and fourth surfaces and corresponding to the through holes.
6. The plasma induced flow electrode structure of claim 5 ,
wherein the electrode layer extends to inside the second through holes.
7. The plasma induced flow electrode structure of claim 5 ,
wherein the insulating plate includes projecting portions disposed around the second through holes and engaged with the through holes.
8. The plasma induced flow electrode structure of claim 5 ,
wherein the first surface of the electrode block includes a plurality of roundish shapes between the through holes; and
wherein the insulating plate includes a plurality of roundish recesses engaged with the roundish shapes.
9. The plasma induced flow electrode structure of claim 1 ,
wherein sizes of the through holes vary in correspondence with distances from a center of the electrode block.
10. The plasma induced flow electrode structure of claim 1 ,
wherein the insulating layer includes a polyimide system resin.
11. A plasma induced flow generation device, comprising:
the plasma induced flow electrode structure of claim 1 ; and
a power supply that apply AC voltage to between the electrode layer and the electrode block.
12. A method of manufacturing a plasma induced flow electrode structure, the method comprising:
preparing an electrode block including a first and a second surface and a plurality of through holes penetrating between the first and second surfaces;
forming an insulating layer on the first surface and inside the through holes; and
forming an electrode layer on the insulating layer of the first surface.
13. The method of manufacturing the plasma induced flow electrode structure of claim 12 ,
wherein the step of forming the insulating layer includes bonding an insulating film to the electrode block.
14. The method of manufacturing the plasma induced flow electrode structure of claim 12 ,
wherein the step of forming the insulating layer includes inserting the electrode block into a shell of an insulating material.
15. The method of manufacturing the plasma induced flow electrode structure of claim 12 , further comprising
preparing an insulating plate including a third and a fourth surface, a plurality of second through holes, and the electrode layer, the second through holes penetrating between the third and fourth surfaces and corresponding to the through holes, the electrode layer being disposed on the third surface,
wherein the step of forming the electrode layer includes bonding the fourth surface of the insulating plate to the insulating layer on the first surface.