Plasma processing apparatus and plasma processing method
A plasma processing apparatus includes: a reaction chamber; a plasma generation unit; a stage disposed inside the reaction chamber; an electrostatic chuck mechanism including an electrode portion inside the stage; a heater inside the stage; a support portion which supports a conveyance carrier between a stage-mounted position on the stage and a transfer position distant from the stage upward; and an elevation mechanism which elevates and lowers the support portion relative to the stage. In a case in which the conveyance carrier is mounted on the stage by lowering the support portion, application of voltage to the electrode portion is started in a state that the stage is being heated, and the plasma generation unit generates plasma after at least a part of an outer circumferential portion of a holding sheet holding the conveyance carrier contacts the stage and also after the heating of the stage is stopped.
1. A plasma processing method for performing plasma processing on a substrate that is held by a conveyance carrier that is mounted on a stage that is disposed in a reaction chamber, the conveyance carrier comprising a holding sheet that holds the substrate and a frame that is attached to an outer circumferential portion of the holding sheet, the stage comprising therein an electrode portion of an electrostatic chuck mechanism and a heater, said plasma processing method comprising:
causing a support portion, which is capable of being elevated and lowered relative to the stage, to support the conveyance carrier at a transfer position that is distant from the stage upward;
mounting the conveyance carrier to a stage-mounted position on the stage by lowering the support portion;
applying a voltage to the electrode portion;
heating the stage by a heater; and
generating plasma in the reaction chamber,
wherein the voltage application to the electrode portion is started in a state that the stage is being heated, and
wherein the plasma is generated after at least a part of the outer circumferential portion of the holding sheet contacts the stage and also after the heating of the stage is stopped.
2. A plasma processing method for performing plasma processing on a substrate that is held by a conveyance carrier that is mounted on a stage that is disposed in a reaction chamber, the conveyance carrier comprising a holding sheet that holds the substrate and a frame that is attached to an outer circumferential portion of the holding sheet, the stage comprising therein an electrode portion of an electrostatic chuck mechanism and a heater, said plasma processing method comprising:
stopping application of a voltage that has been applied to the electrode portion;
heating the stage by the heater;
causing a support portion, which is capable of being elevated and lowered relative to the stage, to support the conveyance carrier at a stage-mounted position on the stage; and
separating the conveyance carrier from the stage by elevating the support portion after the application of the voltage is stopped,
wherein the support portion is elevated after a start of the heating of the stage.
3. A plasma processing method for performing plasma processing on a substrate that is held by a conveyance carrier that is mounted on a stage that is disposed in a reaction chamber, the conveyance carrier comprising a holding sheet that holds the substrate and a frame that is attached to an outer circumferential portion of the holding sheet, said plasma processing method comprising:
causing a support portion, which is capable of being elevated and lowered relative to the stage, to support the conveyance carrier at a transfer position that is distant from the stage upward;
mounting the conveyance carrier to a stage-mounted position on the stage by lowering the support portion; and
applying a voltage to an electrode portion of an electrostatic chuck mechanism that is disposed inside the stage,
wherein the support portion is lowered so that the holding sheet comes into contact with the stage in a state that the frame is inclined with respect to the stage.
4. The plasma processing method according to claim 3 , wherein voltage application to the electrode portion is started before the contact of the outer circumferential portion of the holding sheet to the stage.
5. The plasma processing method according to claim 3 , wherein an angle of inclination of the frame with respect to the stage when the holding sheet starts contacting the stage is from 0.01° to 5.0°.
6. A plasma processing method for performing plasma processing on a substrate that is held by a conveyance carrier that is mounted on a stage that is disposed in a reaction chamber, the conveyance carrier comprising a holding sheet that holds the substrate and a frame that is attached to an outer circumferential portion of the holding sheet, said plasma processing method comprising:
causing a support portion capable of being elevated and lowered relative to the stage to support, at a stage-mounted position, the conveyance carrier being mounted on the stage; and
separating the conveyance carrier from the stage in a state that the frame is inclined with respect to the stage by elevating the support portion.
7. The plasma processing method according to claim 6 , wherein an angle of inclination of the frame with respect to the stage when the conveyance carrier starts being separated from the stage is from 0.01° to 5.0°.