Offset-printing method for three-dimensional package
The present invention discloses an offset-printing method for a three-dimensional 3D-oP (three-dimensional offset-printed memory)-based package. The mask-patterns for different 3D-op dice are merged onto a same data-mask. At different printing steps, a wafer is offset by different values with respect to the data-mask. Accordingly, data-patterns from a same data-mask are printed into different 3D-oP dice.
1. An offset-printing method for a three-dimensional 3D-oP (three-dimensional offset-printed memory)-based package, comprising the steps of:
1) forming a substrate circuit on a semiconductor wafer, wherein said wafer comprises at least first, second and fourth 3D-oP dice, with said second 3D-oP die adjacent to said first 3D-oP die along the y direction and said fourth 3D-oP die adjacent to said first 3D-oP die along the x direction;
2) a first printing step for transferring a first plurality of mask patterns of a data-mask to a first data-coding layer in said first, second and fourth 3D-oP dice, wherein an origin of said data-mask is initially aligned to an origin of said first die at said first printing step;
3) a second printing step for transferring a second plurality of mask patterns of said data-mask to a second data-coding layer in said first, second and fourth 3D-oP dice, wherein said origin of said data-mask is initially aligned to an origin of said second die at said second printing step;
wherein said first and second plurality of mask patterns are from a same data-mask; and said first and fourth 3D-oP dice are vertically stacked in said 3-D package.
2. The method according to claim 1 , wherein said data-mask comprises a plurality of mask regions whose patterns correspond to said first and second plurality of mask patterns.
3. The method according to claim 2 , wherein said 3D-oP dice comprises at least first and second memory levels with said second memory level located above said first memory level, wherein said first data-coding layer is located in said first memory level and said second data-coding layer is located in said second memory level.
4. The method according to claim 3 , wherein a mask pattern of a first mask-region is transferred to said first data-coding layer in said first die at said first printing step.
5. The method according to claim 3 , wherein a mask pattern of a second mask-region is transferred to said first data-coding layer in said second die at said first printing step.
6. The method according to claim 3 , wherein a mask pattern of a fourth mask-region is transferred to said first data-coding layer in said fourth die at said first printing step.
7. The method according to claim 3 , wherein a mask pattern of a third mask-region is transferred to said second data-coding layer in said first die at said second printing step.
8. The method according to claim 4 , wherein said mask pattern of said first mask-region is transferred to said second data-coding layer in said second die at said second printing step.
9. The method according to claim 3 , wherein a mask pattern of a sixth mask-region is transferred to said second data-coding layer in said fourth die at said second printing step.
10. The method according to claim 2 , wherein said 3D-oP dice comprises at least a memory level, wherein said first and second data-coding layers are located in said memory level.
11. The method according to claim 10 , wherein a mask pattern of a first mask-region is transferred to said first data-coding layer in said first die at said first printing step.
12. The method according to claim 10 , wherein a mask pattern of a second mask-region is transferred to said first data-coding layer in said second die at said first printing step.
13. The method according to claim 10 , wherein a mask pattern of a fourth mask-region is transferred to said first data-coding layer in said fourth die at said first printing step.
14. The method according to claim 10 , wherein a mask pattern of a third mask-region is transferred to said second data-coding layer in said first die at said second printing step.
15. The method according to claim 11 , wherein the said mask pattern of said first mask-region is transferred to said second data-coding layer in said second die at said second printing step.
16. The method according to claim 10 , wherein a mask pattern of a sixth mask-region is transferred to said second data-coding layer in said fourth die at said second printing step.
17. The method according to claim 1 , wherein a displacement between said first and second 3D-oP dice is smaller than a stepping distance of said first printing step.
18. The method according to claim 1 , wherein a displacement between said first and second 3D-oP dice is smaller than a stepping distance of said second printing step.
19. The method according to claim 1 , wherein said first or second printing step is photo-lithography.
20. The method according to claim 1 , wherein said first or second printing step is imprint-lithography.