IP Library Assignment 070917/0001
Patent Assignment
Reel/Frame 070917/0001

Assignment of Assignor's Interest

Recorded: 2025-04-23 Pages: 11
Assignor
ZHANG, GUOBIAO, DR.
Executed: 2021-04-28
Assignee
CHENGDU HAICUN IP TECHNOLOGY LLC
ROOM 16, FLOOR 34, BUILDING 2, 88 JITAI 5TH ROAD, GAOXIN DISTRICT, CHENGDU, 640041, CHINA
Covered Properties (9)
Offset-Printing Method for Three-Dimensional Package
Patent: 9,990,961 →
Application: 15/381,080 →
Publication: US 2017/0098651
Three-Dimensional Vertical One-Time-Programmable Memory
Application: 15/488,489 →
Publication: US 2017/0301674
Configurable Computing Array Based on Three-Dimensional Vertical Writable Memory
Application: 15/793,927 →
Publication: US 2018/0048315
Night Detection of Side-by-Side Parked Vehicles
Application: 15/628,617 →
Publication: US 2017/0289351
Configurable Computing Array
Application: 15/793,920 →
Publication: US 2018/0048314
Multi-Bit-Per-Cell Three-Dimensional One-Time-Programmable Memory
Application: 15/488,435 →
Publication: US 2017/0301405
Configurable Computing Array Using Two-Sided Integration
Application: 15/793,933 →
Publication: US 2018/0048316
Compact Three-Dimensional Memory with Semi-Conductive Address Line Portion
Application: 15/487,378 →
Publication: US 2017/0221528
Three-Dimensional One-Time-Programmable Memory With A Dummy Word Line
Application: 16/125,713 →
Publication: US 2018/0366206
Related Assignments (1)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 24, 2026
From: CHENGDU HAICUN IP TECHNOLOGY LLC
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 074691/0486 →