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App. No. 09/781,237 · Confirmation No. 8010

RESIN-SEALED CHIP STACK TYPE SEMICONDUCTOR DEVICE

Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
⬇ PDF
 Code Description Pages PDF
2001-02-13 TRNA Transmittal of New Application 2 View
2001-02-13 SPEC Specification 8 View
2001-02-13 CLM Claims 2 View
2001-02-13 ABST Abstract 1 View
2001-02-13 DRW Drawings-only black and white line drawings 3 View
2001-02-13 OATH Oath or Declaration filed 4 View
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Quick Facts
App. No.
09/781,237
Filed
2001-02-13
Granted
2003-04-08
Pub. No.
US20010035587A1
Art Unit
2822
PTA
-55 days