IP Library Granted Patent US 7,259,039
Granted Patent B2
US 7,259,039 · App. 10/818,261 · Granted Aug 21, 2007

Memory device and methods of using and making the device

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Quick Facts
Patent No.
US 7,259,039
App. No.
10/818,261
Granted
Aug 21, 2007
Kind
B2
Abstract

A memory cell made of two electrodes with a controllably conductive media between the two electrodes is disclosed. The controllably conductive media contains an active low conductive layer and passive layer. The controllably conductive media changes its impedance when an external stimuli such as an applied electric field is imposed thereon. Methods of making the memory devices/cells, methods of using the memory devices/cells, and devices such as computers containing the memory devices/cells are also disclosed.

Claims (23)

1. A method of making a memory cell comprising:

providing a first electrode;

forming a passive layer comprising a conductivity facilitating compound over the first electrode, the passive layer having an ability to donate and accept at least one of holes and electrons;

forming a low conductive layer comprising a conjugated organic polymer over the passive layer, wherein the conductivity facilitating compound of the passive layer is selected, the low conductive layer having an ability to donate and accept at least one of holes and electrons, the low conductive layer selected so that the passive layer has a Fermi level within about 0.7 eV of a valence band of the low conductive layer, the conjugated organic polymer is formed by chemical vapor deposition and a catalytic action of the passive layer; and

providing a second electrode over the low conductive layer.

2. The method of claim 1 , wherein the conductivity facilitating compound comprises at least one selected from the group consisting of copper sulfide, silver sulfide, and gold sulfide.

3. The method of claim 1 , wherein the passive layer has a thickness from about 2 Å to about 0.1 μm.

4. The method of claim 1 , wherein the low conductive layer has a thickness from about 0.001 μm to about 5 μm.

5. The method of claim 1 , wherein the passive layer acts as a catalyst when forming the low conductive layer.

6. The method of claim 1 , wherein the low conductive layer comprises a conjugated organic polymer.

7. The method of claim 1 , wherein the passive layer has a Fermi level within about 0.5 eV of a valence band of the low conductive layer.

8. The method of claim 1 , wherein the memory cell has a size area of about 0.0001 μm 2 or more and about 4 μm 2 or less.

9. The method of claim 1 , wherein the passive layer has a Fermi level within about 0.3 eV of a valence band of the low conductive layer.

10. The method of claim 1 , wherein the conductivity facilitating compound comprises copper sulfide.

11. The method of claim 1 , wherein the low conductive layer comprises a polyacetylene.

12. The method of claim 1 , wherein the low conductive layer comprises a polyphenylacetylene.

13. The method of claim 1 , wherein the low conductive layer comprises a polydiphenylacetylene.

14. The method of claim 1 , wherein the low conductive layer comprises a polyaniline.

15. The method of claim 1 , wherein the low conductive layer comprises a poly(p-phenylene vinylene).

16. The method of claim 1 , wherein the low conductive layer comprises a polythiophene.

17. The method of claim 1 , wherein the low conductive layer comprises a polyporphyrin.

18. The method of claim 1 , wherein the low conductive layer comprises a polyvinylene.

19. The method of claim 1 , wherein the low conductive layer comprises a polystirole.

Assignments (10)
CORRECTIVE ASSIGNMENT TO CORRECT THE 8647899 PREVIOUSLY RECORDED ON REEL 035240 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTERST. Recorded Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 14, 2016
From: CYPRESS SEMICONDUCTOR CORPORATION
To: MONTEREY RESEARCH, LLC
Reel/Frame 040911/0238 →
PARTIAL RELEASE OF SECURITY INTEREST IN PATENTS Recorded Aug 11, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 039708/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 30, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036036/0738 →
SECURITY INTEREST Recorded Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
RELEASE OF SECURITY INTEREST Recorded Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
SECURITY AGREEMENT Recorded Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 26, 2007
From: SPANSION INC.
To: SPANSION LLC
Reel/Frame 019065/0945 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 19, 2007
From: ADVANCED MICRO DEVICES, INC.
To: SPANSION INC.
Reel/Frame 019030/0331 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 2, 2004
From: LAN, ZHIDA; VAN BUSKIRK, MICHAEL A.; BILL, COLIN
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 015187/0246 →