IP Library Granted Patent US 7,391,064
Granted Patent B1
US 7,391,064 · App. 11/001,519 · Granted Jun 24, 2008

Memory device with a selection element and a control line in a substantially similar layer

Assignee: Spansion LLC
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Quick Facts
Patent No.
US 7,391,064
App. No.
11/001,519
Granted
Jun 24, 2008
Kind
B1
Abstract

The invention facilitates manufacture of semiconductor memory components by reducing the number of layers required to implement a semiconductor memory device. The invention provides for a selection element to be formed in the same layer as one of the control lines (e.g. one of the wordline and bitline). In one embodiment of the invention, a diode is implemented as the selection element within the same layer as one of the control lines. Production of the selection element within the same layer as one of the wordline and bitline reduces problems associated with vertical stacking, increases device yield and reduces related production costs. The invention also provides an efficient method of producing memory devices with the selection element in the same layer as one of the control lines.

Claims (21)

1. A memory device, comprising:

a memory element;

a first layer comprising a first control line, the first layer is coupled to the memory element;

a second layer comprising a second control line; the second layer is coupled to the memory element; and

a selection element comprising a n-doped region and a p-doped region, created in one of the first layer and the second layer, wherein the control line, the n-doped region and the p-doped region reside in the same layer and the selection element abuts the control line.

2. The memory device of claim 1 , the selection element is a diode.

3. The memory device of claim 1 , the selection element includes a p-n junction.

4. The memory device of claim 1 , the selection element is a Schottky diode.

5. The memory device of claim 1 , the selection element is a zener diode.

6. The memory device of claim 1 , the first control line is a wordline and the second control line is a bitline.

7. The memory device of claim 1 , the first layer further comprises a diode.

8. The memory device of claim 1 , the second layer further comprises a diode.

9. A memory component comprising an array of one or memory devices of claim 1 .

10. A memory device, comprising:

a first layer comprising a wordline and a selection diode comprising a n-doped region and a p-doped region, abutting the wordline, wherein the wordline, the n-doped region and the p-doped region reside in the same layer;

a memory element coupled to the selection diode through a conductive via; and

a second layer comprising a bitline coupled to the memory element.

11. A memory device, comprising:

means for coupling a memory element to a first control line in a first layer;

means for forming a selection element comprising a n-doped region and a p-doped region, and a wordline within a second layer, wherein the control line, the n-doped region and the p-doped region reside in the same layer and the selection element abuts the control line; and

means for interconnecting the memory element and the selection element.

Assignments (8)
CORRECTIVE ASSIGNMENT TO CORRECT THE 8647899 PREVIOUSLY RECORDED ON REEL 035240 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTERST. Recorded Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 14, 2016
From: CYPRESS SEMICONDUCTOR CORPORATION
To: MONTEREY RESEARCH, LLC
Reel/Frame 040911/0238 →
PARTIAL RELEASE OF SECURITY INTEREST IN PATENTS Recorded Aug 11, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 039708/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 30, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036039/0406 →
SECURITY INTEREST Recorded Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
RELEASE OF SECURITY INTEREST Recorded Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
SECURITY AGREEMENT Recorded Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 1, 2004
From: TRIPSAS, NICHOLAS H.; PANGRLE, SUZETTE
To: SPANSION, LLC
Reel/Frame 016063/0506 →