IP Library Granted Patent US 7,285,835
Granted Patent B2
US 7,285,835 · App. 11/066,884 · Granted Oct 23, 2007

Low power magnetoelectronic device structures utilizing enhanced permeability materials

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Quick Facts
Patent No.
US 7,285,835
App. No.
11/066,884
Granted
Oct 23, 2007
Kind
B2
Abstract

Low power magnetoelectronic device structures and methods for making the same are provided. One magnetoelectronic device structure ( 100 ) comprises a programming line ( 104 ), a magnetoelectronic device ( 102 ) magnetically coupled to the programming line, and an enhanced permeability dielectric material ( 106 ) disposed adjacent the magnetoelectronic device. The enhanced permeability dielectric material has a permeability no less than approximately 1.5. A method for making a magnetoelectronic device structure is also provided. The method comprises fabricating a magnetoelectronic device ( 102 ) and depositing a conducting line ( 104 ). A layer of enhanced permeability dielectric material ( 106 ) having a permeability no less than approximately 1.5 is formed, wherein after the step of fabricating a magnetoelectronic device and the step of depositing a conducting line, the layer of enhanced permeability dielectric material is situated adjacent the magnetoelectronic device.

Claims (16)

1. A method for making a magnetoelectronic device structure, the method comprising:

fabricating a magnetoelectronic device;

depositing a conducting line; and

forming, between the magnetoelectronic device and the conducting line, a first layer of enhanced permeability dielectric material having a magnetic permeability no less than approximately 1.5, such that the conducting line is configured to generate a magnetic field that passes through the first layer and acts on the magnetoelectronic device.

2. The method for making a magnetoelectronic device structure of claim 1 , wherein the step of forming a first layer of enhanced permeability dielectric material is performed after the step of depositing a conducting line and before the step of fabricating a magnetoelectronic device.

3. The method for making a magnetoelectronic device structure of claim 1 , wherein the step of forming a first layer of enhanced permeability dielectric material is performed after the step of fabricating a magnetoelectronic device and before the step of depositing a conducting line.

4. The method for making a magnetoelectronic device structure of claim 1 , wherein the step of forming a first layer of enhanced permeability dielectric material having a magnetic permeability no less than approximately 1.5 comprises the step of forming a first layer of enhanced permeability dielectric material having a magnetic permeability in the range of about 2 to about 60.

5. The method for making a magnetoelectronic device structure of claim 1 , further comprising the step of forming a layer of an additional enhanced permeability material having a magnetic permeability no less than approximately 1.5, wherein after the step of fabricating a magnetoelectronic device and the step of depositing a conducting line, said layer of an additional enhanced permeability material is situated between said magnetoelectronic device and said conducting line.

6. The method for making a magnetoelectronic device structure of claim 1 , wherein the step of forming a first layer of enhanced permeability dielectric material comprises the step of forming a layer comprising at least one material selected from the group consisting of alumina, silicon dioxide, silicon nitride, and oxides of magnesium, hafnium, tantalum, titanium, vanadium, and niobium and at least one magnetic material selected from the group consisting of nickel, iron, cobalt, alloys of nickel, alloys of iron, alloys of cobalt, and combinations thereof.

7. The method for making a magnetoelectronic device structure of claim 1 , wherein the step of forming a first layer of enhanced permeability dielectric material comprises the step of forming alternating layers of at least one dielectric material and at least one magnetic nanoparticle material that exhibits super-paramagnetic behavior, wherein each of said layers of at least one magnetic nanoparticle material comprises a discontinuous layer of magnetic nanoparticles.

8. The method for making a magnetoelectronic device structure of claim 7 , wherein the step of forming a first layer of enhanced permeability dielectric material further comprises the step of forming an oxygen barrier layer overlying each of said layers of at least one magnetic nanoparticle material.

9. The method of claim 1 , wherein forming the enhanced permeability dielectric material includes:

depositing a discontinuous layer of nanoparticles exhibiting superparamagnetic properties;

forming a layer of dielectric material overlying said discontinuous layer of nanoparticles; and

alternately repeating the step of depositing a discontinuous layer of nanoparticles and the step of forming a layer of dielectric material until a stack that comprises a plurality of layers of said dielectric material and discontinuous layers of said nanoparticles interposed therebetween is formed having approximately a predetermined thickness.

10. The method of claim 9 , wherein the step of depositing a discontinuous layer of nanoparticles exhibiting super-paramagnetic properties comprises the step of depositing a discontinuous layer of nanoparticles having a size in the range of about 2 nm to about 10 nm.

Assignments (9)
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037354/0225 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037354/0670 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 9, 2015
From: FREESCALE SEMICONDUCTOR, INC.
To: EVERSPIN TECHNOLOGIES, INC.
Reel/Frame 036084/0057 →
RELEASE OF SECURITY INTEREST Recorded Jul 30, 2010
From: CITIBANK, N.A.
To: EVERSPIN TECHNOLOGIES, INC.
Reel/Frame 024767/0398 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 24, 2009
From: FREESCALE SEMICONDUCTOR, INC.
To: EVERSPIN TECHNOLOGIES, INC.
Reel/Frame 022597/0062 →
SECURITY AGREEMENT Recorded Jul 11, 2008
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A.
Reel/Frame 021217/0368 →
SECURITY AGREEMENT Recorded Feb 2, 2007
From: FREESCALE SEMICONDUCTOR, INC.; FREESCALE ACQUISITION CORPORATION; FREESCALE ACQUISITION HOLDINGS CORP.; FREESCALE HOLDINGS (BERMUDA) III, LTD.
To: CITIBANK, N.A. AS COLLATERAL AGENT
Reel/Frame 018855/0129 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 18, 2005
From: RIZZO, NICHOLAS D.; DAVE, RENU; SLAUGHTER, JON M.; PIETAMBARAM, SRINIVAS V.
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 016648/0720 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 24, 2005
From: RIZZO, NICHOLAS; DAVE, RENU; SLAUGHTER, JON M.; PIETAMBARAM, SRINIVAS V.
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 016338/0874 →