IP Library Granted Patent US 7,501,315
Granted Patent B2
US 7,501,315 · App. 11/148,001 · Granted Mar 10, 2009

Methods and devices for forming nanostructure monolayers and devices including such monolayers

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Quick Facts
Patent No.
US 7,501,315
App. No.
11/148,001
Granted
Mar 10, 2009
Kind
B2
Abstract

Methods for forming or patterning nanostructure arrays are provided. The methods involve formation of arrays on coatings comprising nanostructure association groups, patterning using resist, and/or use of devices that facilitate array formation. Related devices for forming nanostructure arrays are also provided, as are devices including nanostructure arrays (e.g., memory devices).

Claims (35)

1. A method for forming a nanostructure array, the method comprising:

providing a first layer;

coating the first layer with a composition comprising a nanostructure association group to provide a coated first layer; and

depositing a population of nanostructures on the coated first layer, wherein each of the nanostructures comprises a coating comprising a ligand associated with a surface of the nanostructure, and wherein the nanostructure association group interacts with the ligand, whereby the nanostructures, wherein depositing the population of nanostructures on the coated first layer optionally comprises depositing nanostructures in excess of a monolayer on the coated first layer; and removing any of said nanostructures which are not associated with the nanostructure association group, thereby forming a monolayer array of nanostructures associated with the coated first layer.

2. The method of claim 1 , wherein the first layer comprises a material selected from the group consisting of: a dielectric material, an oxide, a nitride, silicon oxide, hafnium oxide, and alumina.

3. The method of claim 1 , wherein the first layer is disposed on a substrate.

4. The method of claim 3 , wherein the substrate comprises a semiconductor.

5. The method of claim 4 , wherein the first layer comprises a dielectric material and has a thickness of between about 1 nm and about 10 nm.

6. The method of claim 5 , wherein the substrate comprises a source region, a drain region, and a channel region between the source and drain regions and underlying the monolayer array of nanostructures; the method comprising disposing a control dielectric layer on the monolayer array of nanostructures, and disposing a gate electrode on the control dielectric layer.

7. The method of claim 1 , wherein coating the first layer with the composition comprising the nanostructure association group comprises coating two or more discrete regions of the first layer with the composition, each region occupying a predetermined position on the first layer.

8. The method of claim 1 , wherein the nanostructure association group interacts with the ligand and with a surface of the nanostructures.

9. The method of claim 8 , wherein the nanostructure association group comprises a thiol group.

10. The method of claim 1 , wherein the ligand comprises a silsesquioxane.

11. The method of claim 1 , wherein the nanostructure association group forms a covalent bond with the ligand.

12. The method of claim 1 , wherein the composition is photoactivatable, the method comprising exposing one or more discrete regions of the coated first layer to light, each region occupying a predetermined position on the coated first layer.

13. The method of claim 12 , wherein exposing one or more discrete regions of the coated first layer to the light comprises exposing two or more, 10 or more, 50 or more, 100 or more, 1000 or more, 1×10 4 or more, 1×10 6 or more, 1×10 9 or more, or 1×10 12 or more discrete regions of the coated first layer to the light.

14. The method of claim 12 , wherein each of the nanostructures comprises a coating comprising a silsesquioxane ligand associated with a surface of the nanostructure.

15. The method of claim 1 , wherein coating the first layer with the composition comprising the nanostructure association group comprises coating the first layer with a first compound and then coating the first layer with a second compound which interacts with the first compound, the second compound comprising the nanostructure association group.

16. A method for forming a nanostructure array, the method comprising:

providing a first layer;

coating the first layer with a composition comprising a nanostructure association group to provide a coated first layer;

depositing a population of nanostructures on the coated first layer, whereby the nanostructures associate with the nanostructure association group, wherein depositing the population of nanostructures on the coated first layer comprises depositing a solution comprising the nanostructures dispersed in at least one solvent on the coated first layer; and

removing any nanostructures which are not associated with the nanostructure association group, whereby a monolayer array of nanostructures remains associated with the coated first layer.

17. The method of claim 1 , wherein the monolayer array of nanostructures comprises a disordered array.

18. The method of claim 1 , wherein the monolayer array of nanostructures has a density greater than about 1×10 10 nanostructures/cm 2 , greater than about 1×10 11 nanostructures/cm 2 , greater than about 1×10 12 nanostructures/cm 2 , or greater than about 1×10 13 nanostructures/cm 2 .

19. The method of claim 1 , wherein the nanostructures comprise substantially spherical nanostructures or quantum dots.

20. The method of claim 1 , wherein the nanostructures have a work function of about 4.5 eV or higher.

21. A method for forming a nanostructure array, the method comprising:

providing a device comprising a first layer, a second layer, and a cavity between the first and second layers;

introducing a solution into the cavity, the solution comprising nanostructures dispersed in at least one solvent; and

evaporating at least a portion of the solvent from the cavity, whereby the nanostructures assemble into an array disposed on the first layer.

22. A method for forming a nanostructure array, the method comprising:

providing a solid support comprising at least one vertical discontinuity on its surface, which discontinuity comprises a protrusion from the surface or an indentation in the surface, which protrusion or indentation is at a predetermined position on the solid support;

depositing a solution on the solid support, which solution comprises nanostructures dispersed in at least one solvent; and

evaporating at least a portion of the solvent, whereby the nanostructures assemble into an array disposed on the protrusion or in the indentation.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 12, 2021
From: SANDISK TECHNOLOGIES LLC
To: WODEN TECHNOLOGIES INC.
Reel/Frame 058871/0928 →
CHANGE OF NAME Recorded May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038813/0004 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 14, 2016
From: SANDISK CORPORATION
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 038438/0904 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 6, 2012
From: NANOSYS, INC.
To: SANDISK CORPORATION
Reel/Frame 028326/0269 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 15, 2005
From: HEALD, DAVID L.; CRUDEN, KAREN CHU; DUAN, XIANGFENG; LIU, CHAO; PARCE, J. WALLACE
To: NANOSYS, INC.
Reel/Frame 016541/0279 →