Non-leaded integrated circuit package system with multiple ground sites
View Patent ↗A non-leaded integrated circuit package system is provided providing a die paddle of a lead frame, forming a dual row of terminals including an outer terminal and an inner terminal, and selectively fusing an inner terminal and an adjacent inner terminal to form a fused lead.
1. A method of manufacture of a non-leaded integrated circuit package system comprising:
providing a die paddle of a lead frame;
forming a dual row of terminals of the lead frame including a staggered configuration of an outer terminal in an outer row and an inner terminal in an inner row; and
providing the inner terminal and an adjacent inner terminal to form a fused lead depopulating the inner terminal and the adjacent inner terminal, the fused lead isolated from another inner terminal in the inner row.
2. The method as claimed in claim 1 further comprising encapsulating the die paddle, the fused lead, the outer terminal, and the another inner terminal.
3. The method as claimed in claim 1 wherein providing the inner terminal and the adjacent inner terminal to form the fused lead comprises forming a ground bond site for an integrated circuit die.
4. The method as claimed in claim 1 wherein providing the inner terminal and adjacent inner terminal to form the fused lead comprises providing a ground plane with the fused lead and providing another ground plane with the outer terminal and the another inner terminal.
5. A method of manufacture of a non-leaded integrated circuit package system comprising:
providing a die paddle of a lead frame;
forming a dual row of terminals including an outer terminal in an outer row and an inner terminal in an inner row; and
providing an inner terminal and an adjacent inner terminal to form a fused lead isolated from another inner terminal in the inner row.
6. The method as claimed in claim 5 further comprising forming an extension from the fused lead to an edge of the dual row of terminals and next to the outer terminal.
7. The method as claimed in claim 5 further comprising:
forming an extension from the fused lead to an edge of the dual row of terminals and next to the outer terminal; and
forming a paddle interconnect between the fused lead and the die paddle.
8. The method as claimed in claim 5 wherein providing the inner terminal and the adjacent inner terminal to form the fused lead comprises fusing the inner terminal adjacent to a tie bar and the adjacent inner terminal to form the fused lead.
9. The method as claimed in claim 5 wherein providing the inner terminal and the adjacent inner terminal to form the fused lead comprises:
forming a first fused lead along a first side and a third side; and
forming a second fused lead along a second side and a fourth side.
10. The method as claimed in claim 1 wherein providing the inner terminal and the adjacent inner terminal to form the fused lead comprises forming a ground shield with the fused lead for another inner terminal adjacent to the fused lead.