Multiple flip-chip integrated circuit package system

1. A method of manufacture of an integrated circuit package system comprising:

forming a multi-tier laminate substrate having raised pads on each tier and a pad vertical side of the raised pads coplanar with a tier vertical side of each tier; and

attaching integrated circuits on the raised pads with each integrated circuit

horizontally nested within the raised pads of the tier above.

2. The method as claimed in claim 1 wherein attaching the plurality of integrated circuits comprises attaching a plurality of flipchip integrated circuits.

3. The method as claimed in claim 1 wherein forming the multi-tier substrate comprises forming a tier of the multi-tier substrate having a height from a base of the multi-tier substrate and a width of a mounting surface, different from that of another tier.

4. The method as claimed in claim 1 further comprising attaching a structure on the multi-tier substrate over the plurality of integrated circuits with an encapsulant.

5. The method as claimed in claim 1 wherein forming a structure includes attaching each of the plurality of integrated circuits to another of the plurality of integrated circuits.

6. A method of manufacture of an integrated circuit package system comprising:

forming a multi-tier laminate substrate having raised pads on each tier and a pad vertical side of the raised pads coplanar with a tier vertical side of each tier; and forming a heatsink conductively attached to raised pads in one of the tiers; and attaching of integrated circuits by connectors on the raised pads with each integrated circuit horizontally nested within the raised pads of the tier above.

7. The method as claimed in claim 6 wherein attaching the connectors comprises attaching solder bumps of a plurality of flipchip integrated circuits.

8. The method as claimed in claim 6 wherein forming the multi-tier substrate comprises forming the plurality of tiers having a height from a base of the multi-tier substrate and width of a mounting surface, different from that of an adjacent tier.

9. The method as claimed in claim 6 further comprising attaching the heatsink on the multi-tier substrate over the plurality of integrated circuits with the encapsulant encapsulating the plurality of integrated circuits.

10. The method as claimed in claim 6 wherein:

forming the heatsink comprises:

attaching a top integrated circuit on the heatsink;

attaching a middle integrated circuit on the top integrated circuit;

attaching a bottom integrated circuit on the middle integrated circuit; and

attaching connectors comprises:

mounting bottom connectors of the bottom integrated circuit, middle connectors of the middle integrated circuit, and top connectors of the top integrated circuit with the heatsink thereon, on the multi-tier substrate.

11. An integrated circuit package system comprising:

a multi-tier laminate substrate having raised pads on each tier and a pad vertical side of the raised pads coplanar with a tier vertical side of each tier; and

integrated circuits attached on the raised pads with each integrated circuit horizontally nested within the raised pads of the tier above.

12. The system as claimed in claim 11 wherein the plurality of integrated circuits comprises a plurality of flipchip integrated circuits.

13. The system as claimed in claim 11 wherein the multi-tier substrate comprises a tier of the multi-tier substrate having a height from a base of the multi-tier substrate and a width of a mounting surface, different from that of another tier.

14. The system as claimed in claim 11 further comprising an encapsulant over a structure on the multi-tier substrate and over the plurality of integrated circuits.

15. The system as claimed in claim 11 wherein each of the plurality of integrated circuits is attached to another of the plurality of integrated circuits.

16. The system as claimed in claim 11 wherein:

the multi-tier substrate having a plurality of tiers;

a heatsink having the plurality of integrated circuits attached thereto in tiers; and

the connectors of the plurality of integrated circuits on the plurality of tiers.

17. The system as claimed in claim 16 wherein the connectors comprise solder bumps of a plurality of flipchip integrated circuits.

18. The system as claimed in claim 16 wherein the multi-tier substrate comprises the plurality of tiers having a height from a base of the multi-tier substrate and width of a mounting surface, different from that of an adjacent tier.

19. The system as claimed in claim 16 further comprising the heatsink on the multi-tier substrate over the plurality of integrated circuits with the encapsulant encapsulating the plurality of integrated circuits.

20. The system as claimed in claim 16 wherein:

the heatsink comprises:

a top integrated circuit on the heatsink;

a middle integrated circuit on the top integrated circuit;

a bottom integrated circuit on the middle integrated circuit; and

the connectors comprise:

bottom connectors of the bottom integrated circuit, middle connectors of the middle integrated circuit, and top connectors of the top integrated circuit with the heatsink thereon, on the multi-tier substrate.