Semiconductor device
View Patent ↗A semiconductor device comprises an active layer formed on a substrate, a superlattice layer formed on the active layer, and an ohmic electrode formed on the superlattice layer. In the superlattice layer, a first thin film and a second thin film are alternately laminated. The second thin film is made of a semiconductor which has polarization characteristics different from those of the first thin film and a band gap larger than that of the first thin film. An interface region between an upper surface of the first thin film and a lower surface of the second thin film or an interface region between a lower surface of the first thin film and an upper surface of the second thin film, is doped with an impurity.
1. A semiconductor device comprising:
a first nitride semiconductor layer;
a superlattice layer formed on the first nitride semiconductor layer, and comprising first thin films and second thin films alternately laminated, the first thin film and the second thin film having different polarization characteristics, and a band gap of the second thin film being larger than a band gap of the first thin film; and
an ohmic electrode formed on the superlattice layer,
wherein a region doped with an impurity is formed in a first interface region between a lower surface of the first thin film and an upper surface of the second thin film, and
an impurity concentration in the first interface region is higher than that in a second interface region between an upper surface of the first thin film and a lower surface of the second thin film.
2. The semiconductor device of claim 1 , wherein negative polarization charge occurs in the first interface region in which the doped region is formed.
3. The semiconductor device of claim 1 , further comprising:
a second nitride semiconductor layer doped with an impurity and formed between the superlattice layer and the ohmic electrode.
4. The semiconductor device of claim 1 , wherein a value of a ratio of a thickness of the second thin film to a thickness of the first thin film is different between an upper portion and a lower portion of the superlattice layer.
5. The semiconductor device of claim 4 , wherein the thickness of the first thin film is larger than the thickness of the second thin film in the upper portion of the superlattice layer, and the thickness of the second thin film is larger than the thickness of the first thin film in the lower portion of the superlattice layer.
6. The semiconductor device of claim 1 , wherein a thickness of the second thin film is larger than a thickness of the first thin film.
7. The semiconductor device of claim 6 , wherein a value of a ratio of the thickness of the second thin film to the thickness of the first thin film is more than 1 and no more than 6.
8. The semiconductor device of claim 1 , wherein a value of a sum of a thickness of the first thin film and a thickness of the second thin film is 2 nm or more and 15 nm or less.
9. The semiconductor device of claim 1 , wherein the doped region has an impurity concentration of 1×10 17 cm −3 or more and 1×10 21 cm −3 or less.
10. The semiconductor device of claim 1 , wherein the doped region is a first delta-doped region.
11. The semiconductor device of claim 1 , wherein a second delta-doped region is formed in a region in the first nitride semiconductor layer and at a distance of 0.1 nm or more and 1 μm or less from an interface between the first nitride semiconductor layer and the superlattice layer.
12. The semiconductor device of claim 1 , wherein the first thin film is made of gallium nitride and the second thin film is made of aluminum nitride gallium.
13. The semiconductor device of claim 12 , wherein a plurality of semiconductor films are laminated in the first nitride semiconductor layer, and
an uppermost one of the plurality of semiconductor films is made of aluminum nitride gallium.
14. The semiconductor device of claim 1 , further comprising:
a gate electrode formed on the first nitride semiconductor layer,
wherein the first nitride semiconductor layer comprises a channel layer and a barrier layer laminated together, and a band gap of the barrier layer is larger than a band gap of the channel layer,
the superlattice layer is selectively formed on the first nitride semiconductor layer and on both sides of the gate electrode, and
the ohmic electrode includes a source electrode formed on the superlattice layer on one side of the gate electrode and a drain electrode formed on the superlattice layer on the other side of the gate electrode.
15. The semiconductor device of claim 14 , further comprising:
a high-concentration impurity layer formed between each of the superlattice layers and the barrier layer, and having the same composition as that of the barrier layer and a higher impurity concentration than that of the barrier layer.
16. The semiconductor device of claim 14 , wherein each of the superlattice layers has an opening exposing the first nitride semiconductor layer, and
the source electrode and the drain electrode are each formed contacting a side wall of the corresponding opening.
17. The semiconductor device of claim 14 , wherein each of the superlattice layers has a recess, the recess being an indentation of a portion of the superlattice layer, and
the source electrode and the drain electrode are each formed contacting a side wall of the corresponding recess.
18. The semiconductor device of claim 1 , wherein the impurity is not doped in the second interface region.
19. The semiconductor device of claim 8 , wherein electrons can tunnel through a potential barrier caused by the first thin film and the second thin film.