Integrated circuit package system including zero fillet resin

1. A method of manufacturing an integrated circuit package comprising:

providing a substrate with a first surface including conductive regions for receiving a flip chip die and a second surface including electrical contacts for external electrical connections;

providing the flip chip die over the substrate;

depositing a controlled volume of resin between the first surface of the substrate and the flip chip die including applying the resin in a volume insufficient to fill the volume of space between the first surface of the substrate and the flip chip die; and

adhering the flip chip die to the first surface of the substrate to form the controlled volume of resin into a zero fillet resin contacting an interconnect between the flip chip die and the substrate.

2. The method of claim 1 wherein:

providing the flip chip die includes a die selected from digital signal processor die, application specific integrated circuit die, or micro-processor die.

3. The method of claim 1 wherein:

depositing the controlled volume of resin includes depositing a volume of resin sufficient for assuring adhesion and preventing fillet formation.

4. The method of claim 1 further comprising:

providing a wire bond die over the flip chip die.

5. The method of claim 1 wherein:

manufacturing the integrated circuit package includes forming package-on-package systems or package-in-package systems.

6. A method of manufacturing an integrated circuit package comprising:

providing a substrate with a bond finger on a first surface and solder ball connections on a second surface;

providing a flip chip die;

depositing a controlled volume of resin between the first surface of the substrate and the flip chip die including applying the resin in a volume insufficient to fill the volume of space between the first surface of the substrate and the flip chip die;

adhering the flip chip die to the first surface of the substrate to form the controlled volume of resin into a zero fillet resin;

routing a zero fillet wire bond connection to connect to the medial bond finger region closest to the flip chip die; and

depositing a molding compound.

7. The method of claim 6 wherein:

providing the substrate includes a substrate selected from printed circuit boards, package substrates, silicon substrates or integrated circuit die.

8. The method of claim 6 wherein:

forming the zero fillet resin includes a perimeter region void of resin or filled by a molding compound between the substrate and the flip chip die of about 3 mm in width.

9. The method of claim 6 wherein:

depositing a controlled volume of resin includes pre-applying the resin to the flip chip die or to the substrate.

10. The method of claim 6 wherein:

manufacturing the integrated circuit package includes forming package-on-package systems or package-in-package systems.

11. An integrated circuit packaging system comprising:

a flip chip die;

a substrate with a first surface including conductive regions for receiving the flip chip die and a second surface including electrical contacts for external electrical connections; and

a controlled volume of resin between the first surface of the substrate and the flip chip die, wherein the controlled volume of resin does not extend to the perimeter of the flip chip die, produces a zero fillet resin contacting an interconnect between the flip chip die and the substrate.

12. The system as claimed in claim 11 wherein:

the flip chip die includes a die selected from digital signal processor die, application specific integrated circuit die, or micro-processor die.

13. The system as claimed in claim 11 wherein:

the controlled volume of resin includes a volume of resin sufficient for assuring adhesion and preventing fillet formation.

14. The system as claimed in claim 11 further comprising:

a wire bond die over the flip chip die.

15. The system as claimed in claim 11 wherein:

the integrated circuit packaging system includes package-on-package systems or package-in-package systems.

16. The system as claimed in claim 11 wherein:

the substrate includes a bond finger on the first surface and solder ball connections on the second surface;

a zero fillet wire bond connection connected to a medial bond finger region closest to the flip chip die; and

a molding compound that encapsulates the packaging system.

17. The system as claimed in claim 16 wherein:

the substrate includes the substrate selected from printed circuit boards, package substrates, silicon substrates or integrated circuit die.

18. The system as claimed in claim 16 wherein:

the zero fillet resin includes a perimeter region void of resin or filled with a molding compound between the substrate and the flip chip die in the range of 1 to 3 mm in width.

19. The system as claimed in claim 16 wherein:

the controlled volume of resin is applied primarily to the flip chip die or to the substrate.

20. The system as claimed in claim 16 wherein:

the integrated circuit package includes package-on-package systems or package-in-package systems.