Oxygen elimination for device processing
View Patent ↗A method includes forming at least a portion of a semiconductor device in a processing chamber containing oxygen and removing substantially all of the oxygen from the processing chamber. The method further includes forming remaining portions of the semiconductor device in the processing chamber without the presence of oxygen.
1. A method, comprising:
forming at least a portion of a semiconductor device in a processing chamber containing oxygen, where the at least a portion of the semiconductor device comprises a layer of dielectric material and where the at least a portion of the semiconductor device further comprises the layer of dielectric material formed on a nitride layer, the nitride layer formed on an oxide layer, and the oxide layer formed on a substrate;
removing substantially all of the oxygen from the processing chamber; and
forming remaining portions of the semiconductor device in the processing chamber without the presence of oxygen.
2. The method of claim 1 , wherein removing substantially all of the oxygen from the processing chamber comprises:
evacuating the oxygen from the processing chamber.
3. The method of claim 1 , wherein removing substantially all of the oxygen from the processing chamber comprises:
displacing the oxygen in the processing chamber with another gas.
4. The method of claim 3 , wherein the gas comprises N 2 .
5. The method of claim 1 , wherein the semiconductor device comprises a non-volatile memory.
6. The method of claim 1 , wherein the layer of dielectric material comprises Al 2 O 3 .
7. The method of claim 1 , wherein removal of the oxygen from the processing chamber inhibits degradation of device performance due to oxygen reaction with the layer of dielectric material.
8. A method of forming a memory device, comprising:
forming a first layer comprising an oxide material on a substrate in a processing chamber;
forming a second layer comprising a material for storing charges on the first layer;
forming a third layer comprising a high dielectric constant material on the second layer;
forming a fourth layer comprising a gate electrode material on the third layer;
etching the first, second, third and fourth layers to produce a gate structure;
removing oxygen from the processing chamber; and
forming a remaining portion of the memory device without the presence of the oxygen.
9. The method of claim 8 , wherein the dielectric constant of the third layer is greater than the dielectric constant of the first layer.
10. The method of claim 9 , wherein the dielectric constant of the third layer is approximately greater than 7.
11. The method of claim 8 , wherein removing the oxygen from the processing chamber comprises:
evacuating the oxygen from the processing chamber.
12. The method of claim 8 , wherein removing the oxygen from the processing chamber comprises:
displacing the oxygen in the processing chamber with another gas.
13. The method of claim 12 , wherein the gas comprises N 2 .
14. The method of claim 8 , wherein the first layer comprises a silicon oxide, the second layer comprises a nitride, the third layer comprises an aluminum oxide, and the fourth layer comprises polysilicon.
15. A method of forming a memory device, comprising:
forming a first layer comprising an oxide material on a substrate in a processing chamber;
forming a second layer comprising a material for storing charges on the first layer;
forming a third layer comprising a high dielectric constant material on the second layer;
forming a fourth layer comprising a gate electrode material on the third layer;
etching the first, second, third and fourth layers to produce a gate structure;
removing at least a substantial portion of gaseous oxygen contained in the processing chamber; and
forming a remaining portion of the memory device subsequent to removing the at least a substantial portion of gaseous oxygen from the processing chamber.
16. The method of claim 15 , where the dielectric constant of the third layer is greater than the dielectric constant of the first layer.
17. The method of claim 15 , where removing the at least a substantial portion of gaseous oxygen contained in the processing chamber comprises:
evacuating at least about 95% of the gaseous oxygen from the processing chamber.
18. The method of claim 15 , where removing the at least a substantial portion of gaseous oxygen contained in the processing chamber comprises:
displacing at least about 95% of the gaseous oxygen in the processing chamber with another gas.
19. The method of claim 18 , where the other gas comprises N 2 .
20. The method of claim 15 , where the first layer comprises a silicon oxide, the second layer comprises a nitride, the third layer comprises an aluminum oxide, and the fourth layer comprises polysilicon.