Methods and apparatus for determining pad height for a wire-bonding operation in an integrated circuit
View Patent ↗An integrated circuit having an integrated circuit die and at least one height-sensing pad disposed on a top surface of the integrated circuit die and electrically isolated from the die circuitry. At least one bond pad is disposed on a top surface of the integrated circuit die and electrically connected to the die circuitry. The at least one bond pad is configured for wire-bonding to a lead of a leadframe utilizing a height coordinate of the at least one height-sensing pad.
1. An integrated circuit comprising:
an integrated circuit die;
at least one height-sensing pad disposed on a top surface of the integrated circuit die and electrically isolated from the die circuitry;
at least one bond pad disposed on a top surface of the integrated circuit die and electrically connected to the die circuitry, wherein the at least one bond pad is configured for wire-bonding to a lead of a leadframe utilizing a height coordinate of the at least one height-sensing pad;
wherein the at least one height-sensing pad is substantially dimensionally identical to the at least one bond pad.
2. The integrated circuit of claim 1 , wherein the at least one bond pad is configured for wire-bonding through a determination of a height coordinate of the at least one bond pad.
3. The integrated circuit of claim 2 , wherein the height coordinate of the at least one height-sensing pad is used in determining the height coordinate of the at least one bond pad.
4. The integrated circuit of claim 1 , wherein the at least one bond pad comprises a bond rail.
5. The integrated circuit of claim 4 , wherein the height-sensing pad is arranged adjacent to the bond rail.
6. The integrated circuit of claim 1 , wherein the at least one bond pad comprises a bond rail and a plurality of bond pads.
7. The integrated circuit of claim 1 , wherein the top surface of the integrated circuit die comprises a plurality of height-sensing pads, each corresponding to one of a plurality of bond pads.
8. The integrated circuit of claim 1 , wherein the at least one height-sensing pad is disposed further from the die circuitry than the at least one bond pad.
9. The integrated circuit of claim 1 , wherein a height-sensing pad is disposed at each corner of the integrated circuit die.
10. The integrated circuit of claim 1 , wherein at least three height-sensing pads are disposed on the top surface of the integrated circuit die.
11. The integrated circuit of claim 10 , wherein height coordinates obtained from the at least three height-sensing pads provide a determination of a plane of the integrated circuit die.
12. The integrated circuit of claim 11 , wherein the plane of the integrated circuit die provides a determination of a tilt of the integrated circuit die with respect to a bonding tool.
13. The integrated circuit of claim 12 , wherein the height coordinate of the at least one bond pad is determined using the height coordinate of the at least one height-sensing pad and the tilt of the integrated circuit die.