IP Library Granted Patent US 7,573,743
Granted Patent B2
US 7,573,743 · App. 11/514,391 · Granted Aug 11, 2009

Semiconductor device and control method of the same

Assignee: Spansion LLC
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Quick Facts
Patent No.
US 7,573,743
App. No.
11/514,391
Granted
Aug 11, 2009
Kind
B2
Abstract

A semiconductor device includes: a first sector ( 12 ) having data that are all to be erased and having flash memory cells; a second sector ( 14 ) having data that are all to be retained and having flash memory cells; a sector select circuit ( 16 ) selecting a pair of sectors from among sectors during erasing the data in the first sector, said pair of sectors being the first sector and the second sector; and an SRAM array (storage) ( 30 ) retaining the data of the second sector. The present invention can provide a semiconductor device in which a reduced number of sector select circuits is used so that the area of memory cell array can be reduced and provide a method of controlling the semiconductor device.

Claims (24)

1. A semiconductor device comprising:

a first sector having data that are all to be erased and having flash memory cells;

a second sector having data that are all to be retained and having flash memory cells;

a sector select circuit selecting a pair of sectors from among sectors during erasing the data in the first sector, said pair of sectors being the first sector and the second sector; and

a storage retaining the data of the second sector, wherein the data of the second sector is stored prior to erasing of the pair of sectors.

2. The semiconductor devices as claimed in claim 1 , further comprising a control circuit that writes data stored in the second sector into the storage, erases data in the first sector and the second sector, and writes data stored in the storage into the second sector.

3. The semiconductor device as claimed in claim 2 , further comprising:

a read circuit that reads data from the second sector for retaining the data in the storage; and

a storage write circuit that receives the data from the read circuit, and writes the data into the storage.

4. The semiconductor device as claimed in claims 2 , further comprising:

a storage read circuit that reads data from the storage for writing the data into the second sector; and

a write circuit that receives the data from the storage read circuit, and writes the data into the second sector.

5. The semiconductor device as claimed in claim 1 , wherein a storage capacity of the first sector is substantially the same as that of the second sector.

6. The semiconductor device as claimed in claim 5 , wherein the storage capacities of the first storage and the second storage are substantially the same as a storage capacity of the storage.

7. The semiconductor device as claimed in claim 1 , further comprising:

a main bit line connected to the sectors via the sector select circuit; and

a sub bit line commonly provided to the first and second sectors and connected to the non-volatile memory cells of the first and second sectors,

the sector select circuit including a select transistor that selectively making a connection of the sub bit line with the main bit line.

8. The semiconductor device as claimed in claim 1 , wherein the non-volatile memory cells are flash memory cells.

9. A method of controlling a semiconductor device comprising:

writing data stored in a second sector having flash memory cells into a storage;

erasing data in a first sector having flash memory cells and the data the second sector, wherein the erasing of data in the first sector and the second sector is performed after the writing of data in the second sector into the storage; and

writing the data stored in the storage into the second sector.

10. The method as claimed in claims 9 , wherein erasing the data includes selecting a pair of sectors from among sectors, said a pair of sectors being the first sector and the second sector.

Assignments (8)
CORRECTIVE ASSIGNMENT TO CORRECT THE 8647899 PREVIOUSLY RECORDED ON REEL 035240 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTERST. Recorded Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 14, 2016
From: CYPRESS SEMICONDUCTOR CORPORATION
To: MONTEREY RESEARCH, LLC
Reel/Frame 040911/0238 →
PARTIAL RELEASE OF SECURITY INTEREST IN PATENTS Recorded Aug 11, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 039708/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 1, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036044/0122 →
SECURITY INTEREST Recorded Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
RELEASE OF SECURITY INTEREST Recorded Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
SECURITY AGREEMENT Recorded Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 17, 2006
From: MURAKAMI, HIROKI; KURIHARA, KAZUHIRO
To: SPANSION LLC.
Reel/Frame 018417/0122 →
Continuity (2)
Continuation In Part PCTJP200501569500 · Aug 30, 2005
Related Publication 20070047369A1 · Mar 1, 2007