IP Library › Granted Patent US 7,560,304
Granted Patent Utility
US 7,560,304 · Confirmation No. 4636

METHOD OF MAKING A SEMICONDUCTOR DEVICE HAVING MULTIPLE DIE REDISTRIBUTION LAYER

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2009-06-24 ISSUE.NTF Issue Notification 1 View
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2009-04-21 A.NA Amendment after Notice of Allowance (Rule 312) 1 View
2009-04-21 SPEC Specification 1 View
2009-04-21 REM Applicant Arguments/Remarks Made in an Amendment 1 View
2009-04-21 N417 Electronic Filing System Acknowledgment Receipt 2 View
2009-03-09 NOA Notice of Allowance and Fees Due (PTOL-85) 7 View
2009-03-09 892 List of references cited by examiner 1 View
2009-03-09 BIB Bibliographic Data Sheet 1 View
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2009-03-09 1449 List of References cited by applicant and considered by examiner 2 View
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2009-03-09 1449 List of References cited by applicant and considered by examiner 2 View
2009-03-09 1449 List of References cited by applicant and considered by examiner 2 View
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2007-12-04 IDS Information Disclosure Statement (IDS) Form (SB08) 2 View
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2006-12-28 ADS Application Data Sheet 4 View
2006-12-28 SPEC Specification 16 View
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Quick Facts
Patent No.
US 7,560,304
App. No.
11/617,689
Filed
2006-12-28
Granted
2009-07-14
Pub. No.
US20080160674A1
Art Unit
2891
PTA
-4 days