Semiconductor device and programming method
View Patent ↗The present invention include a semiconductor device and a method therefor, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefor, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion.
1. A semiconductor device comprising:
a semiconductor chip;
a chip mounting portion mounting the semiconductor chip;
a sheet-shaped resin portion provided at a side of the semiconductor chip opposite to the chip mounting portion;
a resin sealing portion provided between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip; and
a wire connected between the semiconductor chip and the chip mounting portion, wherein the wire is provided in contact with the sheet-shaped resin portion.
2. The semiconductor device claimed in claim 1 , wherein the sheet-shaped resin does not include a filler.
3. The semiconductor device claimed in claim 1 , wherein the resin sealing portion is partially provided between the sheet-shaped resin portion and the semiconductor chip.
4. The semiconductor device claimed in claim 1 , wherein the sheet-shaped resin portion is provided in contact with the semiconductor chip.
5. The semiconductor device as claimed in claim 1 further comprising:
a wire connected between the semiconductor chip and the chip mounting portion, wherein the wire is partially embedded in the sheet-shaped resin portion.
6. The semiconductor device as claimed in claim 1 further comprising:
a second sheet-shaped resin portion at a side of the chip mounting portion opposite to the semiconductor chip, wherein the resin sealing portion is provided between the sheet-shaped resin portion and the second sheet-shaped resin portion.
7. The semiconductor device as claimed in claim 1 , further comprising:
a conductive sheet provided at a side of the sheet-shaped resin opposite to the semiconductor chip.
8. The semiconductor chip as claimed in claim 1 , wherein the semiconductor chip has stacked semiconductor chips.
9. A semiconductor device comprising:
a semiconductor chip;
a chip mounting portion mounting the semiconductor chip;
a sheet-shaped resin portion provided at a side of the semiconductor chip opposite to the chip mounting portion; and
a resin sealing portion provided between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip; and
a wire connected between the semiconductor chip and the chip mounting portion, wherein the wire is partially embedded in the sheet-shaped resin portion.
10. The semiconductor device as claimed in claim 9 , wherein the sheet-shaped resin does not include a filler.
11. The semiconductor device as claimed in claim 9 , wherein the resin sealing portion is partially provided between the sheet-shaped resin portion and the semiconductor chip.
12. The semiconductor device as claimed in claim 9 , wherein the sheet-shaped resin portion is provided in contact with the semiconductor chip.
13. The semiconductor device as claimed in claim 9 further comprising:
a wire connected between the semiconductor chip and the chip mounting portion, wherein the wire is provided in contact with the sheet-shaped resin portion.
14. The semiconductor device as claimed in claim 9 further comprising:
a second sheet-shaped resin portion at a side of the chip mounting portion opposite to the semiconductor chip, wherein the resin sealing portion is provided between the sheet-shaped resin portion and the second sheet-shaped resin portion.
15. The semiconductor device as claimed in claim 9 , further comprising:
a conductive sheet provided at a side of the sheet-shaped resin opposite to the semiconductor chip.
16. The semiconductor chip as claimed in claim 9 , wherein the semiconductor chip has stacked semiconductor chips.