Multi-chip package system with multiple substrates

1. A method of manufacturing for a multi-chip package system comprising:

providing a first carrier having a first non-exposed side opposite a first exposed side with terminals thereon;

attaching a first integrated circuit die to the first non-exposed side, the first integrated circuit die connected to the terminals through the first carrier;

providing a second carrier;

placing the first carrier coplanar with the second carrier; and

molding a package encapsulation around and exposing the first carrier.

2. The method as claimed in claim 1 wherein:

providing the first carrier having the first integrated circuit die includes:

providing a first integrated circuit package system having the first integrated circuit die and the first carrier; and

providing the second carrier also includes:

providing a second integrated circuit package system having a second integrated circuit die and the second carrier.

3. The method as claimed in claim 1 further comprising mounting a device over the first integrated circuit die.

4. The method as claimed in claim 1 wherein molding the package encapsulation around the first carrier includes:

covering a first edge of the first carrier and a second edge of the second carrier with the package encapsulation; and

molding the package encapsulation over the first integrated circuit die.

5. The method as claimed in claim 1 wherein:

providing the second carrier includes:

providing an outer carrier having an opening; and

placing the first carrier coplanar with the second carrier also includes:

placing the first carrier in the opening coplanar with the outer carrier.

6. A method of manufacturing for a multi-chip package system comprising:

providing a first integrated circuit package system having a first carrier including a first non-exposed side opposite a first exposed side with terminals thereon;

attaching a first integrated circuit die to the first non-exposed side, the first integrated circuit die connected to the terminals through the first carrier;

providing a second carrier;

placing the first carrier coplanar with the second carrier;

connecting the first carrier and the second carrier; and

molding a package encapsulation around and exposing the first carrier.

7. The method as claimed in claim 6 wherein:

providing the second carrier includes:

providing a second integrated circuit package system having a second integrated circuit die and the second carrier; and

further comprising:

mounting a device over the first integrated circuit package system and the second integrated circuit package system.

8. The method as claimed in claim 6 further comprising:

mounting a first device over the first integrated circuit package system; and

mounting a second device over the second carrier.

9. The method as claimed in claim 6 wherein molding the package encapsulation around the first carrier and the second carrier includes covering the first integrated circuit package system with the package encapsulation.

10. The method as claimed in claim 6 further comprising:

providing an outer carrier having an opening;

connecting the outer carrier with the first carrier and the second carrier; and

wherein placing the first carrier coplanar with the second carrier includes:

placing the first carrier and the second carrier in the opening coplanar with the outer carrier.

11. A multi-chip package system comprising:

a first carrier having a first non-exposed side opposite a first exposed side with terminals thereon;

a first integrated circuit die attached to the first non-exposed side, the first integrated circuit die connected to the terminals through the first carrier;

a second carrier coplanar with the first carrier; and

a package encapsulation around and exposing the first carrier.

12. The system as claimed in claim 11 wherein:

the first carrier having the first integrated circuit die includes:

a first integrated circuit package system having the first integrated circuit die and the first carrier; and

the second carrier having the second integrated circuit die also includes:

a second integrated circuit package system having a second integrated circuit die and the second carrier.

13. The system as claimed in claim 11 further comprising mounting a device over the first integrated circuit die.

14. The system as claimed in claim 11 wherein the package encapsulation includes:

the package encapsulation as a cover for a first edge of the first carrier and a second edge of the second carrier; and

the package encapsulation over the first integrated circuit die.

15. The system as claimed in claim 11 wherein:

the second carrier includes:

an outer carrier having an opening; and

the first carrier coplanar with the second carrier also includes:

the first carrier in the opening is coplanar with the outer carrier.

16. The system as claimed in claim 11 wherein:

the first carrier is part of a first integrated circuit package system having the first integrated circuit die;

the second carrier is a substrate coplanar with the first carrier; and

the package encapsulation is a cover around and exposing the first carrier.

17. The system as claimed in claim 16 further comprising:

a second integrated circuit package system having a second integrated circuit die and the second carrier; and

a device over the first integrated circuit package system and the second integrated circuit package system.

18. The system as claimed in claim 16 further comprising:

a first device over the first integrated circuit package system; and

a second device over the second carrier.

19. The system as claimed in claim 16 wherein the package encapsulation includes the package encapsulation over the first integrated circuit package system.

20. The system as claimed in claim 16 further comprising:

an outer carrier having an opening and connected with the first carrier and the second carrier; and

wherein the first carrier coplanar with the second carrier includes:

the first carrier and the second carrier in the opening coplanar with the outer carrier.