IP Library Granted Patent US 7,799,612
Granted Patent B2
US 7,799,612 · App. 11/767,623 · Granted Sep 21, 2010

Process applying die attach film to singulated die

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Quick Facts
Patent No.
US 7,799,612
App. No.
11/767,623
Granted
Sep 21, 2010
Kind
B2
Abstract

Methods and systems of applying a plurality of pieces of die attach film to a plurality of singulated dice are provided. The method can involve making intervals between rows and columns of a plurality of pieces of die attach film. The interval can be made by expanding an underlaid expandable film on which the plurality of pieces of die attach film are placed or by removing portions of the die attach film between rows and columns of the plurality of pieces of die attach film. The method can further involve placing a plurality of singulated dice back side down on the plurality of pieces of die attach film.

Claims (24)

1. A method of applying a plurality of pieces of die attach film to a plurality of singulated dice, comprising:

making intervals between rows and columns of a plurality of pieces of die attach film by expanding an underlaid expandable film on which the plurality of pieces of die attach film are placed or by removing portions of the die attach film between rows and columns of the plurality of pieces of die attach film; and

placing a plurality of singulated dice back side down on the plurality of pieces of die attach film.

2. The method of claim 1 , wherein expanding the underlaid expandable film comprising heating the expandable film to elevated temperatures.

3. The method of claim 1 , wherein removing portions of the die attach film comprises sawing the die attach film one or more times by a blade.

4. The method of claim 1 , wherein all of the intervals between the rows and columns of the plurality of pieces of die attach film are substantially the same.

5. The method of claim 1 , wherein placing a plurality of singulated dice back side down on the plurality of pieces of die attach film comprises picking and placing individually each of the plurality of singulated dice back side down on the plurality of pieces of die attach film.

6. The method of claim 1 , wherein placing a plurality of singulated dice back side down on the plurality of pieces of die attach film comprises remounting the plurality of singulated dice back side down on the plurality of pieces of die attach film.

7. The method of claim 1 further comprising applying pressure on the plurality of dice after placing the plurality of singulated dice back side down on the plurality of pieces of die attach film.

8. The method of claim 1 further comprising removing the underlaid expandable film on which the plurality of pieces of die attach film are placed.

9. The method of claim 1 further comprising attaching the singulated die to a substrate by the piece of the die attach film.

10. The method of claim 6 , wherein remounting the plurality of singulated dice back side down on the plurality of pieces of die attach film comprises placing a film having the plurality of singulated dice on the plurality of pieces of die attach film.

11. A method of applying a plurality of pieces of die attach film to a plurality of singulated dice, comprising:

placing the plurality of singulated dice back side down on a film;

remounting the plurality of singulated dice front side down on an first expandable film by placing the film having the plurality of singulated dice on the first expandable film;

removing the film from the back side surfaces of the plurality of singulated dice;

making intervals between rows and columns of the plurality of singulated dice by expanding the first expandable film;

making intervals between rows and columns of a plurality of pieces of die attach film; and

remounting the plurality of singulated dice back side down on the plurality of pieces of die attach film by placing the first expandable film having the plurality of singulated dice on the plurality of pieces of die attach film.

12. The method of claim 11 , wherein making intervals between rows and columns of the plurality of pieces of die attach film comprises expanding an underlaid second expandable film on which the plurality of pieces of die attach film are placed or removing portions of the die attach film between the plurality of pieces of die attach film.

13. The method of claim 11 further comprising removing the first expandable film from the front side surfaces of the singulated dice.

14. The method of claim 11 , wherein the intervals between the rows and columns of the plurality of singulated dice are the substantially same as the intervals between the rows and columns of the plurality of pieces of die attach film.

15. The method of claim 11 further comprising attaching the singulated die to a substrate by the piece of the die attach film.

16. The method of claim 12 further comprising removing the underlaid second expandable film on which the plurality of pieces of die attach film are placed.

Assignments (10)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 15, 2022
From: CYPRESS SEMICONDUCTOR CORPORATION
To: INFINEON TECHNOLOGIES LLC
Reel/Frame 059721/0467 →
RELEASE OF SECURITY INTEREST Recorded Mar 16, 2022
From: MUFG UNION BANK, N.A.
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 059410/0438 →
CORRECTIVE ASSIGNMENT TO CORRECT THE 8647899 PREVIOUSLY RECORDED ON REEL 035240 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTERST. Recorded Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Oct 28, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MUFG UNION BANK, N.A.
Reel/Frame 050896/0366 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 1, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036042/0212 →
SECURITY INTEREST Recorded Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
RELEASE OF SECURITY INTEREST Recorded Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
SECURITY AGREEMENT Recorded Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
CORRECTIVE ASSIGNMENT TO CORRECT THE SPELLING OF THE NAMED INVENTORS PREVIOUSLY RECORDED ON REEL 019472 FRAME 0562. ASSIGNOR(S) HEREBY CONFIRMS THE SPELLING OF THE NAMED INVENTORS. Recorded Aug 6, 2007
From: FOONG, SALLY; TAN, KIAH LING; KEE, CHENG SIM; WONG, KWET NAM; FOONG, YUE HO
To: SPANSION LLC
Reel/Frame 019648/0036 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2007
From: FOONG, SALLY; LING, TAN KIAH; SIM, KEE CHENG; NAM, WONG KWET; FOONG, YUE HO
To: SPANSION LLC
Reel/Frame 019472/0562 →