Integrated circuit package system with under paddle leadfingers
An integrated circuit package system is provided including: forming a die paddle; forming an under paddle leadframe including lower leadfingers thereon; attaching the under paddle leadframe to the die paddle with the lower leadfingers extending under the die paddle; attaching a die to the die paddle; and planarizing the bottom surface of the under paddle leadframe to separate the lower leadfingers under the die paddle.
1. An integrated circuit package system comprising:
a die paddle;
lower leadfingers extending under the die paddle and terminating with lead pads at ends thereof;
a die attached to the die paddle; and
encapsulant encapsulating the die paddle, the die, and the lower leadfingers.
2. The system as claimed in claim 1 wherein the lower leadfingers have the top surfaces thereof coplanar with the bottom surface of the die paddle.
3. The system as claimed in claim 1 wherein the lower leadfingers have the top surfaces thereof coplanar with the top surface of the die paddle.
4. The system as claimed in claim 1 wherein the lower leadfingers extend different distances under the die paddle.
5. The system as claimed in claim 1 wherein:
the die paddle has paddle tie bars; and
frame tie bars are attached to the paddle tie bars.
6. An integrated circuit package system comprising:
a die paddle;
leadfingers around the die paddle;
lower leadfingers and lead pads at ends of the lower leadfingers around the die paddle and extending under the die paddle;
a die attached to the die paddle;
bonding wires among the die, the leadfingers, the lower leadfingers, and the lead pads; and
an encapsulant encapsulating the bonding wires, the die, the leadfingers, the lower leadfingers, and the lead pads with bottom surfaces of the leadfingers, the lower leadfingers, and the lead pads exposed.
7. The system as claimed in claim 6 wherein:
the top surfaces of the lower leadfingers are coplanar with the bottom surface of the die paddle; and
the bottom surfaces of the leadfingers are coplanar with the bottom surfaces of the lead pads.
8. The system as claimed in claim 6 wherein:
the top surfaces of the lower leadfingers are coplanar with the top surface of the die paddle; and
the bottom surfaces of the leadfingers are coplanar with the bottom surface of the lead pads.
9. The system as claimed in claim 6 wherein the lower leadfingers extend the lead pads different distances under the die paddle.
10. The system as claimed in claim 6 wherein:
the die paddle has paddle tie bars; and
frame tie bars having bent portions are attached to the paddle tie bars.