IP Library Granted Patent US 7,811,851
Granted Patent B2
US 7,811,851 · App. 11/864,246 · Granted Oct 12, 2010

Phase change memory structures

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Quick Facts
Patent No.
US 7,811,851
App. No.
11/864,246
Granted
Oct 12, 2010
Kind
B2
Abstract

A phase change memory cell has a first electrode, a plurality of pillars, and a second electrode. The plurality of pillars are electrically coupled with the first electrode. Each of the pillars comprises a phase change material portion and a heater material portion. The second electrode is electrically coupled to each of the pillars. In some examples, the pillars have a width less than 20 nanometers.

Claims (29)

1. A method of forming a phase change memory cell, comprising:

forming a first electrode layer over a substrate;

forming a plurality of pillars electrically coupled to and over the first electrode layer, wherein each of the plurality of pillars including a phase change material portion and a heater material portion; and

forming a second electrode electrically coupled to each of the plurality of pillars.

2. The method of claim 1 , wherein the step of forming the plurality of pillars is further characterized by the phase change material portion being over the heater material portion.

3. The method of claim 1 , wherein the step of forming the plurality of pillars is further characterized by the phase change material portions comprising at least one of a group consisting of germanium, antimony, and tellurium.

4. The method of claim 1 , wherein the step of forming the plurality of pillars is further characterized by:

forming layer of heater material over the first electrode layer;

forming a layer of phase change material over the layer of heater material;

etching through the layer of phase change material; and

etching at least partially through the layer of heater material.

5. The method of claim 1 , wherein the step of forming the plurality of pillars is further characterized by:

forming layer of heater material over the first electrode layer;

forming a layer of phase change material over the first electrode layer;

providing nanoclusters over the layer of heater material and over the layer of phase change material, wherein the nanoclusters define a pattern;

etching through the layer of phase change material as per the pattern; and

etching at least partially through the layer of heater material as per the pattern.

6. The method of claim 1 further comprising:

forming a layer of heater material, wherein the heater material portion of each pillar of the plurality of pillars is formed from the layer of heater material,

forming a layer of phase change material wherein the phase change material portion of each of the plurality of pillars is formed from the layer of phase change material;

providing nanoclusters over the layer of heater material and over the layer of phase change material, wherein the nanoclusters define a pattern;

wherein a location of the plurality of pillars is defined as per the pattern.

7. The method of claim 1 , wherein the step of forming the plurality of pillars is further characterized by the plurality of pillars each having a width of less than 20 nanometers.

8. The method of claim 1 , wherein the step of forming the plurality of pillars is further characterized by the plurality of pillars having a spacing of less than 20 nanometers.

9. The method of claim 1 , further comprising forming an insulating material surrounding each of the plurality of pillars.

10. The method of claim 1 , wherein the step of forming the plurality of pillars is further characterized by the phase change material portions comprising a combination including a first material and a second material, wherein:

the first material is one of a class group consisting of a group IB material, a group III material, a group IV material, a group V material, and a group VI material;

the second material is one of the class group but not a same group of the class group as the first material.

11. The method of claim 1 , wherein the step of forming the plurality of pillars is further characterized by the heater material portions including at least one of a group consisting of titanium, aluminum, nitrogen, silicon, tantalum, and tungsten.

Assignments (23)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 17, 2018
From: NXP USA, INC.
To: VLSI TECHNOLOGY LLC
Reel/Frame 045084/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040632 FRAME: 0001. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Sep 21, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 044209/0047 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
CHANGE OF NAME Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040632/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037518/0292 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0553 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037354/0704 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0143 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030633/0424 →
SECURITY AGREEMENT Recorded May 13, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 024397/0001 →
SECURITY AGREEMENT Recorded Mar 15, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A.
Reel/Frame 024085/0001 →
SECURITY AGREEMENT Recorded Feb 16, 2008
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A.
Reel/Frame 020518/0215 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 28, 2007
From: MURALIDHAR, RAMACHANDRAN; MERCHANT, TUSHAR P.; RAO, RAJESH A.
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 019897/0230 →