Integrated circuit package system with pedestal structure

1. An integrated circuit package system comprising:

providing a bond finger;

forming a pedestal on a portion of the bond finger;

providing a first die adjacent to the bond finger;

embedding a portion of the bond finger and a portion of the pedestal in a resin layer with an exposed portion of the pedestal protruding from the resin layer; and

electrically coupling the first die to the exposed portion of the pedestal.

2. The system as claimed in claim 1 , wherein electrically coupling further comprises:

connecting wires between a top surface of the first die and the exposed portion of the pedestal.

3. The system as claimed in claim 1 , further comprising:

providing a substrate supporting the bond finger;

providing a flip chip die supporting the first die; and

mounting the flip chip die on the substrate with bumps.

4. The system as claimed in claim 1 , wherein the pedestal is formed by plating, screen printing, stud bumping, or a combination thereof.

5. The system as claimed in claim 1 further comprising:

encapsulating the first die, the bond finger, the resin layer, and the pedestal with an encapsulant.

6. An integrated circuit package system comprising:

providing a bond finger;

forming a pedestal on a portion of the bond finger;

providing a wire bond die adjacent to the bond finger;

embedding a portion of the bond finger and a portion of the pedestal in a resin layer with an exposed portion of the pedestal protruding from a bleed of the resin layer; and

electrically coupling the wire bond die to the exposed portion of the pedestal.

7. The system as claimed in claim 6 wherein electrically coupling further comprises:

connecting wires between a top surface of the wire bond die and the exposed portion of the pedestal.

8. The system as claimed in claim 6 further comprising:

providing a substrate supporting the bond finger thereon;

mounting a flip chip die on the substrate with solder bumps; and

supporting the wire bond die on the flip chip die.

9. The system as claimed in claim 6 wherein embedding further comprises:

exposing a top radially outer portion of the pedestal.

10. The system as claimed in claim 6 further comprising:

encapsulating a flip chip die, the wire bond die, the bond finger, the resin layer, and the pedestal with an encapsulant.

11. An integrated circuit package system comprising:

a bond finger;

a pedestal formed on a portion of the bond finger;

a first die adjacent the bond finger;

a resin layer embedding a portion of the bond finger and a portion of the pedestal; and

a wire electrically coupled to the first die and an exposed portion of the pedestal protruding from the resin layer.

12. The system as claimed in claim 11 further comprising:

a substrate; and

a flip chip die with bumps mounted on the substrate.

13. The system as claimed in claim 11 wherein the pedestal is of a material with a wire bondable finish on the top surface thereof.

14. The system as claimed in claim 11 wherein the exposed portion of the pedestal further comprises:

an exposed top radially outer portion of the pedestal.

15. The system as claimed in claim 11 further comprising:

an encapsulant encapsulating the first die, the bond finger, the resin layer, the pedestal, and the wire.

16. The system as claimed in claim 11 wherein:

the first die is a wire bond die; and

the resin layer embedding a portion of the pedestal is a bleed of the resin layer.

17. The system as claimed in claim 16 further comprising a substrate having solder balls.

18. The system as claimed in claim 16 wherein the exposed portion of the pedestal further comprises:

an exposed top radially outer portion of the pedestal.

19. The system as claimed in claim 16 further comprising:

an encapsulant encapsulating a flip chip supporting the wire bond die, the bond finger, the resin layer, the pedestal, and the wire.

20. The system as claimed in claim 16 wherein the pedestal has a top surface with a wire bondable finish.