Leadframe designs for plastic overmold packages
View Patent ↗The specification describes a plastic overmolded package for high power devices that has a very low lead count, typically fewer than eight, and in a preferred embodiment, only two. The leads occupy essentially the same linear space as the multiple leads in a conventional package and thus have a wide-blade configuration. To improve mechanical integrity, the leads in the package are provided with retention slots to add back the equivalent of the plastic joints in the spaces that were eliminated due to the wide-blade design. The retention slots extend in the width dimension of the leads.
1. A plastic overmolded package comprising:
a. a leadframe, the leadframe having a top side and a bottom side, and comprising:
i. a die attachment portion on the top side of the leadframe,
ii. at least one semiconductor device attached to the die attachment portion on the top side of the leadframe, with the bottom side of the leadframe devoid of a semiconductor device,
iii. at least two leads extending from the center die attachment portion, the leads having a width W lead and a thickness T,
iv. at least one slot formed in at least one of the leads, the at least one slot having a width W slot and a length L, wherein length L is substantially greater than width W slot , and wherein the length L of the slot extends along the width W lead of the lead, and further wherein the at least one slot extends through the thickness T of the lead thus providing an inboard slot edge nearest to a semiconductor device and an outboard slot edge furthest from the device,
b. a plastic overmold comprising an integral body having a top, a bottom and sidewalls, the plastic overmold filling the at least one slot and additionally encapsulating the semiconductor device and the bottom of the leadframe while leaving a portion of the leads exposed, the exposed portions of the leads extending away from the sidewalls of the overmold.
2. The package of claim 1 wherein the inboard slot edge is essentially a straight edge.
3. The package of claim 1 wherein the leadframe has exactly two leads.
4. The package of claim 1 wherein the leadframe comprises no more than six leads.
5. The package of claim 1 wherein the inboard slot edge has length L p and L p is greater than 0.3×W lead .
6. The package of claim 1 wherein W slot /T is at least 1.
7. The package of claim 1 wherein the leadframe comprises N>1 leads on one side of the plastic overmolded package, the leads separated by distance s, wherein:
L p >0.3[( N×W lead )+( N− 1) s]
where L p is the sum of the inboard slot edges on the one side of the plastic overmolded package, and W lead is the width of the leads.
8. The package of claim 1 , wherein:
a plurality of slots are formed in the at least one lead, each slot of the plurality of slots having a width W slot and a length L, wherein length L is substantially greater than width W slot , and wherein the length L of the slot extends along the width W lead of the lead; and
each slot of the plurality of slots extends through the thickness T of the lead thus providing an inboard slot edge nearest to a semiconductor device and an outboard slot edge further from the device.
9. The package of claim 8 , wherein the plurality of slots line up end-to-end on the at least one lead.
10. The package of claim 8 , wherein the plurality of slots are formed in rows.