IP Library Granted Patent US 7,895,550
Granted Patent B2
US 7,895,550 · App. 12/103,825 · Granted Feb 22, 2011

On chip local MOSFET sizing

Assignee: LSI Corporation
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Quick Facts
Patent No.
US 7,895,550
App. No.
12/103,825
Granted
Feb 22, 2011
Kind
B2
Abstract

A method for reducing variation in a desired property between transistors in an integrated circuit that is fabricated with a given process. The process is characterized to form a mathematical model that associates changes in polysilicon density and active density in the integrate circuit with changes in gate length and gate width in the transistors, and associates changes in the gate length and the gate width to the desired property. The integrated circuit is laid out with space sufficient to adjust the gate length and the gate width of the transistors without violating design rules of the transistors. The integrated circuit is divided into portions, and for at least a given one of the portions of the integrated circuit, the polysilicon density and the active density of the given portion is measured. For at least one of the transistors in the given portion of the integrated circuit, at least one of the gate length and the gate width of the transistor is selectively adjusted according to the mathematical model, based on at least one of the polysilicon density and the active density of the given portion, to reduce variation in the desired property between the transistors in the integrated circuit.

Claims (50)

1. A processor-based method for reducing variation in a desired property between transistors in an integrated circuit that is fabricated with a given process, the method comprising the steps of:

using the processor, characterizing the given process to form a mathematical model that,

associates changes in polysilicon density and active density in a design for the integrate circuit with changes in gate length and gate width in the transistors, and

associates changes in the gate length and the gate width to the desired property,

laying out the integrated circuit design with space sufficient to adjust the gate length and the gate width of the transistors without violating design rules of the transistors,

dividing the integrated circuit design into virtual portions,

for at least a given one of the portions of the integrated circuit design, measuring the polysilicon density and the active density of the portion,

determining whether an adjustment to at least one of the gate length and the gate width will reduce variation in the desired property between the transistors in the portion of the integrated circuit design,

using the processor, for at least one of the transistors in the given portion of the integrated circuit design, selectively adjusting at least one of the gate length and the gate width of the transistor according to the mathematical model based on at least one of the polysilicon density and the active density of the portion, to reduce variation in the desired property between the transistors in the integrated circuit design, and

fixing the integrated circuit design into a non-transitory medium.

2. The method of claim 1 , wherein the desired property of the transistors are electrical properties.

3. The method of claim 1 , wherein the desired property of the transistors include at least one of current density and voltage threshold.

4. The method of claim 1 , wherein the polysilicon density and the active density are measured for all portions of the integrated circuit.

5. The method of claim 1 , wherein at least one of the gate length and the gate width is adjusted for all of the transistors in the at least one portion.

6. The method of claim 1 , wherein the gate width is adjusted before adjusting the gate length, and if the variation is reduced to a desired degree by the adjustment to the gate width, then the gate length is not adjusted.

7. The method of claim 1 , wherein the gate width is adjusted if the adjustment does not violate the design rules.

8. The method of claim 1 , wherein the gate length is adjusted before adjusting the gate width, and if the variation is reduced to a desired degree by the adjustment to the gate length, then the gate width is not adjusted.

9. The method of claim 1 , wherein the gate length is adjusted if the adjustment does not violate the design rules.

10. The method of claim 1 , wherein both the gate width and the gate length are adjusted.

11. A processor-based method for reducing variation in desired electrical properties between transistors in an integrated circuit that is fabricated with a given process, the method comprising the steps of:

using the processor, characterizing the given process to form a mathematical model that,

associates changes in polysilicon density and active density in a design for the integrate circuit with changes in gate length and gate width in the transistors, and

associates changes in the gate length and the gate width to the desired electrical properties,

laying out the integrated circuit design with space sufficient to adjust the gate length and the gate width of the transistors without violating design rules of the transistors,

dividing the integrated circuit design into virtual portions,

for at least one of the portions of the integrated circuit design, measuring the polysilicon density and the active density of the portion,

determining whether an adjustment to at least one of the gate length and the gate width will reduce variation in the desired property between the transistors in the portion of the integrated circuit design,

using the processor, for at least one of the transistors in each portion of the integrated circuit design, selectively adjusting at least one of the gate length and the gate width of the transistor according to the mathematical model based on at least one of the polysilicon density and the active density of the portion, to reduce variation in the desired property between the transistors in the integrated circuit design, wherein

if an adjustment to the gate width does not violate the design rules, then the gate width is adjusted before adjusting the gate length, and if the variation is reduced to a desired degree by the adjustment to the gate width, then the gate length is not adjusted, and

fixing the integrated circuit design into a non-transitory medium.

12. The method of claim 11 , wherein the desired electrical properties of the transistors include at least one of current density and voltage threshold.

13. The method of claim 11 , wherein the polysilicon density and the active density are measured for all portions of the integrated circuit.

14. The method of claim 11 , wherein at least one of the gate length and the gate width is adjusted for all of the transistors in the at least one portion.

15. The method of claim 11 , wherein the gate length is only adjusted if the adjustment does not violate the design rules.

16. The method of claim 11 , wherein both the gate width and the gate length are adjusted if the adjustment does not violate the design rules.

17. A processor-based method for reducing variation in desired electrical properties, including at least one of current density and voltage threshold, between transistors in an integrated circuit that is fabricated with a given process, the method comprising the steps of:

using the processor, characterizing the given process to form a mathematical model that,

associates changes in polysilicon density and active density in a design for the integrate circuit with changes in gate length and gate width in the transistors, and

associates changes in the gate length and the gate width to the desired electrical properties,

laying out the integrated circuit design with space sufficient to adjust the gate length and the gate width of the transistors without violating design rules of the transistors,

dividing the integrated circuit design into virtual portions,

for at least one of the portions of the integrated circuit design, measuring the polysilicon density and the active density of the portion,

determining whether an adjustment to at least one of the gate length and the gate width will reduce variation in the desired property between the transistors in the portion of the integrated circuit design,

using the processor, for at least one of the transistors in each portion of the integrated circuit design, selectively adjusting at least one of the gate length and the gate width of the transistor according to the mathematical model based on at least one of the polysilicon density and the active density of the portion, to reduce variation in the desired property between the transistors in the integrated circuit design, wherein

if an adjustment to the gate width does not violate the design rules, then the gate width is adjusted before adjusting the gate length, and if the variation is reduced to a desired degree by the adjustment to the gate width, then the gate length is not adjusted, and

the gate length is only adjusted if the adjustment does not violate the design rules, and

fixing the integrated circuit design into a non-transitory medium.

18. The method of claim 17 , wherein the polysilicon density and the active density are measured for all portions of the integrated circuit.

19. The method of claim 17 , wherein at least one of the gate length and the gate width is adjusted for all of the transistors in the at least one portion.

20. The method of claim 17 , wherein both the gate width and the gate length are adjusted.

Assignments (9)
RELEASE OF SECURITY INTEREST Recorded Apr 15, 2022
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
Reel/Frame 059720/0223 →
SECURITY INTEREST Recorded Feb 1, 2018
From: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
To: CORTLAND CAPITAL MARKET SERVICES LLC, AS COLLATERAL AGENT
Reel/Frame 045216/0020 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2017
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; BROADCOM CORPORATION
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 044887/0109 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032856-0031) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LSI CORPORATION; AGERE SYSTEMS LLC
Reel/Frame 037684/0039 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2015
From: LSI CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035390/0388 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: LSI CORPORATION; AGERE SYSTEMS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032856/0031 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 16, 2008
From: WALKER, JOHN Q.; BURLESON, JEFFREY P.; SERVICE, SCOTT A.; HOWARD, STEVEN L.
To: LSI CORPORATION
Reel/Frame 020811/0913 →
Continuity (1)
Related Publication 20090265675A1 · Oct 22, 2009