Semiconductor device and method of conforming conductive vias between insulating layers in saw streets
View Patent ↗A semiconductor device is made by disposing a plurality of semiconductor die on a carrier and creating a gap between each of the semiconductor die. A first insulating material is deposited in the gap. A portion of the first insulating material is removed. A conductive layer is formed over the semiconductor die. A conductive lining is conformally formed on the remaining portion of the first insulating material to form conductive via within the gap. The conductive vias can be tapered or vertical. The conductive via is electrically connected to a contact pad on the semiconductor die. A second insulating material is deposited in the gap over the conductive lining. A portion of the conductive via may extend outside the first and second insulating materials. The semiconductor die are singulated through the gap. The semiconductor die can be stacked and interconnected through the conductive vias.
1. A method of making a semiconductor device, comprising:
providing a wafer having a plurality of semiconductor die separated by a saw street, each semiconductor die having an active surface and a contact pad disposed over the active surface of the semiconductor die away from the saw street;
dicing the wafer by cutting a channel through the saw street;
placing the diced wafer on a table;
expanding the table to separate the semiconductor die by physically moving each semiconductor die with respect to each other and form a gap between the separated semiconductor die wider than the channel cut through the saw street, the gap being formed away from the contact pad of the semiconductor die;
depositing a first insulating material in the gap;
removing a portion of the first insulating material;
forming a conductive layer over the semiconductor die, the conductive layer being electrically connected to the contact pad of the semiconductor die;
conforming a conductive lining to a remaining portion of the first insulating material to form the conductive via within the gap, the conductive via being electrically connected to the conductive layer;
depositing a second insulating material in the gap over the conductive lining; and
singulating through the gap to separate the semiconductor die.
2. The method of claim 1 , wherein the conductive via is tapered or vertical.
3. The method of claim 1 , wherein a portion of the conductive via extends outside the first and second insulating materials.
4. The method of claim 1 , wherein a portion of the second insulating material is recessed.
5. The method of claim 1 , wherein the wafer is singulated through the conductive via to form a conductive half via.
6. The method of claim 1 , further including forming a plurality of rows of conductive vias in the gap.
7. The method of claim 1 , further including:
stacking a plurality of semiconductor die; and
electrically interconnecting the plurality of semiconductor die through the conductive vias.
8. A method of making a semiconductor device, comprising:
providing a plurality of semiconductor die each having an active surface and contact pad disposed over the active surface of the semiconductor die;
placing the semiconductor die on a substrate;
separating the semiconductor die by physically moving each semiconductor die relative to each other to form a gap between the separated semiconductor die;
depositing a first insulating material in the gap between the semiconductor die;
removing a portion of the first insulating material;
forming a conductive layer over the semiconductor die, the conductive layer being electrically connected to the contact pad on the semiconductor die;
conforming a conductive lining to a remaining portion of the first insulating material to form a conductive via within the gap, the conductive via being electrically connected to the conductive layer; and
depositing a second insulating material in the gap over the conductive lining.
9. The method of claim 8 , further including:
removing the semiconductor die from a first carrier after depositing the first insulating material; and
mounting the semiconductor die to a second carrier.
10. The method of claim 8 , wherein the conductive via is tapered or vertical.
11. The method of claim 8 , wherein a portion of the conductive via extends outside the first and second insulating materials.
12. The method of claim 8 , wherein a portion of the second insulating material is recessed.
13. The method of claim 8 , further including:
stacking a plurality of semiconductor die; and
electrically interconnecting the plurality of semiconductor die through the conductive vias.
14. A method of making a semiconductor device, comprising:
providing a plurality of semiconductor die;
placing the semiconductor die on a substrate;
separating the semiconductor die by physically moving each semiconductor die relative to each other to form a gap between the separated semiconductor die;
depositing a first insulating material in the gap;
removing a portion of the first insulating material;
forming a conductive layer over the semiconductor die, the conductive layer being electrically connected to the contact pad on the semiconductor die;
conforming a conductive lining to a remaining portion of the first insulating material to form a conductive via within the gap, the conductive lining being electrically connected to the conductive layer; and
depositing a second insulating material in the gap over the conductive lining.
15. The method of claim 14 , wherein the conductive via is tapered or vertical.
16. The method of claim 14 , wherein a portion of the conductive via extends outside the first and second insulating materials.
17. The method of claim 14 , wherein a portion of the second insulating material is recessed.
18. The method of claim 14 , further including:
stacking a plurality of semiconductor die; and
electrically interconnecting the plurality of semiconductor die through the conductive vias.
19. A method of making a semiconductor device, comprising:
providing a plurality of semiconductor die;
physically separating the semiconductor die by physically moving the semiconductor die relative to each other so that no portion of adjacent semiconductor die makes contact and thereby form a gap between the physically separated semiconductor die;
depositing a first insulating material in the gap to extend from a first surface of the semiconductor die to a second surface of the semiconductor die opposite the first surface when deposited;
forming a conductive layer over the semiconductor die;
forming a conductive lining over the first insulating material to create a conductive via within the gap, the conductive lining having a horizontal segment and vertical segment electrically connected to the conductive layer;
depositing a second insulating material in the gap over the conductive lining; and
singulating through the second insulating layer and horizontal segment of the conductive lining in the gap while leaving a portion of the horizontal segment of the conductive lining within the gap for electrical interconnect, thus separating the semiconductor die.
20. The method of claim 19 , wherein the conductive via is tapered or vertical.
21. The method of claim 19 , wherein a portion of the conductive via extends outside the first and second insulating materials.
22. The method of claim 19 , wherein a portion of the second insulating material is recessed.
23. The method of claim 19 , further including:
stacking a plurality of semiconductor die; and
electrically interconnecting the plurality of semiconductor die through the conductive vias.
24. The method of claim 19 , further including forming a plurality of rows of conductive vias in the gap.