Method of forming electrodeposited contacts
View Patent ↗A contact metallurgy structure comprising a patterned dielectric layer having cavities on a substrate; a silicide or germanide layer such as of cobalt and/or nickel located at the bottom of cavities; a contact layer comprising Ti or Ti/TiN located on top of the dielectric layer and inside the cavities and making contact to the silicide or germanide layer on the bottom; a diffusion barrier layer located on top of the contact layer and inside the cavities; optionally a seed layer for plating located on top of the barrier layer; a metal fill layer in vias is provided along with a method of fabrication. The metal fill layer is electrodeposited with at least one member selected from the group consisting of copper, rhodium, ruthenium, iridium, molybdenum, gold, silver, nickel, cobalt, silver, gold, cadmium and zinc and alloys thereof. When the metal fill layer is rhodium, ruthenium, or iridium, an effective diffusion barrier layer is not required between the fill metal and the dielectric. When the barrier layer is platable, such as ruthenium, rhodium, platinum, or iridium, the seed layer is not required.
1. A method for fabricating a contact metallurgy structure which comprises:
obtaining a patterned dielectric layer having cavities located on a substrate;
forming a silicide or germanide layer located at the bottom of cavities;
providing a contact layer comprising Ti located in cavities contacting the silicide or germanide on the bottom of the cavities and on top of the dielectric layer;
depositing a diffusion barrier layer located in cavities and on top of the contact layer;
and electroplating a metal fill layer of at least one member selected from the group consisting of copper, ruthenium, rhodium, iridium, molybdenum, gold, silver, nickel, cadmium, zinc and cobalt and alloys thereof.
2. The method of claim 1 wherein the diffusion barrier layer is at least one member selected from the group consisting of ruthenium, platinum, iridium, and rhodium.
3. The method according to claim 1 which further comprises planarizing by CMP after the electroplating.
4. The method according to claim 1 wherein the cavities have an aspect ratio of at least 3.
5. The method according to claim 1 wherein the metal fill comprises copper, rhodium, ruthenium, iridium, silver, gold, nickel, cobalt, molybdenum, or zinc or alloys thereof, or alloys of these metals with W, or light doping elements of P, B, S, Cl, O, N, F, Br, and I.
6. A method for fabricating a contact metallurgy structure which comprises
obtaining a patterned dielectric layer having cavities located on a substrate;
forming a silicide or germanide layer located at the bottom of cavities;
providing a contact layer comprising Ti located in cavities contacting the silicide or germanide layer at the bottom of the cavities and on top of the silicide or germanide layer;
electroplating a metal fill layer comprising rhodium, ruthenium, or iridium or an alloy thereof.
7. The method of claim 6 which further comprises providing barrier layer in cavities and on top of the contact layer and depositing a seed layer between the barrier layer and metal fill.
8. The method according to claim 6 which further comprises planarizing by CMP after the electroplating.