Integrated circuit package system with flexible substrate and mounded package

1. A method of manufacturing of an integrated circuit package system comprising: providing a flexible circuit substrate; mounting an integrated circuit or an integrated circuit package over the flexible circuit substrate and connected to the flexible circuit substrate with interconnects; and encapsulating the integrated circuit or integrated circuit package with a mounded encapsulation having a first level and a second level, the second level having the flexible circuit substrate folded thereover.

2. The method as claimed in claim 1 wherein: encapsulating with the mounded encapsulation includes encapsulating with the mounded encapsulation having a first level in an offset.

3. The method as claimed in claim 1 wherein:

providing the flexible circuit substrate includes providing the flexible circuit substrate with a base and mounting an integrated circuit package, or a second integrated circuit package system thereto.

4. The method as claimed in claim 1 wherein:

mounting the integrated circuit package includes mounting the integrated circuit package above the first level and connected to the flexible circuit substrate above the second level with solder ball interconnects.

5. The method as claimed in claim 1 further comprising:

mounting a passive component on a fold of the flexible circuit substrate or above the flexible circuit substrate.

6. A method of manufacturing of an integrated circuit package system comprising:

providing a flexible circuit substrate with a substrate window; mounting an integrated circuit or an integrated circuit package over the flexible circuit substrate and connected to the flexible circuit substrate with interconnects; encapsulating the integrated circuit or integrated circuit package with a mounded encapsulation having a first level and a second level; folding the flexible circuit substrate over the second level and the first level is in the substrate window; and

mounting a second integrated circuit, or a second integrated circuit package above the second level of the mounded encapsulation and connected to the flexible circuit substrate.

7. The method as claimed in claim 6 wherein: mounting the integrated circuit or the integrated circuit package over the flexible circuit substrate includes mounting a wire-bonded die, a flip chip, an integrated circuit package, or a combination thereof over the flexible circuit substrate.

8. The method as claimed in claim 6 wherein: mounting the integrated circuit over the flexible circuit substrate includes mounting a flip chip over the flexible circuit substrate and exposed from the first level of the mounded encapsulation.

9. The method as claimed in claim 6 wherein:

mounting the second integrated circuit, or the second integrated circuit package above the second level of the mounded encapsulation includes mounting the second integrated circuit, or the second integrated circuit package with an overhang.

10. The method as claimed in claim 6 wherein: folding the flexible circuit substrate over the second level includes: connecting the flexible circuit substrate directly to the second level;

attaching the flexible circuit substrate to the second level with die attach adhesive; or folding the flexible circuit substrate over the second level and over the integrated circuit package.

11. An integrated circuit package system comprising:

a flexible circuit substrate;

an integrated circuit or an integrated circuit package mounted over the flexible circuit substrate and connected to the flexible circuit substrate with interconnects; and

a mounded encapsulation encapsulating the integrated circuit or integrated circuit package having a first level and a second level, the second level having the flexible circuit substrate folded thereover.

12. The system as claimed in claim 11 wherein: the mounded encapsulation includes a first level in an offset.

13. The system as claimed in claim 11 wherein:

the flexible circuit substrate has a base and an integrated circuit package, or a second integrated circuit package system is mounted thereto.

14. The system as claimed in claim 11 wherein: the integrated circuit package is mounted above the first level and connected to the flexible circuit substrate above the second level with solder ball interconnects.

15. The system as claimed in claim 11 further comprising: a passive component mounted on a fold of the flexible circuit substrate or above the flexible circuit substrate.

16. The system as claimed in claim 11 further comprising: a substrate window having the first level of the molded encapsulation therein; and wherein: a second integrated circuit, or a second integrated circuit package is mounted above the second level of the mounded encapsulation and connected to the flexible circuit substrate.

17. The system as claimed in claim 16 wherein: the integrated circuit or the integrated circuit package includes a wire-bonded die, a flip chip, an integrated circuit package, or a combination thereof over the flexible circuit substrate.

18. The system as claimed in claim 16 wherein: the integrated circuit mounted over the flexible circuit substrate is a flip chip over the flexible circuit substrate and exposed from the first level of the mounded encapsulation.

19. The system as claimed in claim 16 wherein: the second integrated circuit, or the second integrated circuit package includes the second integrated circuit, or the second integrated circuit package with an overhang.

20. The system as claimed in claim 16 wherein: the flexible circuit substrate folded over the second level is: connected directly to the second level; attached to the second level with die attach adhesive; or folded over the second level and over the integrated circuit package.