Integrated circuit package system with wire-in-film isolation barrier
View Patent ↗An integrated circuit package in package system includes: providing a substrate having a first wire-bonded die with an active side mounted above; connecting the active side of the first wire-bonded die to the substrate with a bond-wire; mounting a wire-in-film adhesive having an isolation barrier over the first wire-bonded die; and encapsulating the first wire-bonded die, the bond-wires, and the wire-in-film adhesive with an encapsulation.
1. An integrated circuit package in package system comprising:
a substrate having a first wire-bonded die with an active side mounted above;
a bond-wire connecting the active side of the first wire-bonded die to the substrate;
a wire-in-film adhesive having a gradient density barrier over the first wire-bonded die; and
an encapsulation encapsulating the first wire-bonded die, the bond-wires, and the wire-in-film adhesive.
2. The system as claimed in claim 1 wherein:
the gradient density barrier includes a substantially linear density progression.
3. The system as claimed in claim 1 wherein:
the gradient density barrier includes a substantially exponential density progression.
4. The system as claimed in claim 1 further comprising:
a structure mounted over the wire-in-film adhesive.
5. A method of manufacture of an integrated circuit package in package system comprising:
providing a substrate having a first wire-bonded die with an active side mounted above;
connecting the active side of the first wire-bonded die to the substrate with a bond-wire;
mounting a wire-in-film adhesive having a gradient density barrier over the first wire-bonded die; and
encapsulating the first wire-bonded die, the bond-wires, and the wire-in-film adhesive with an encapsulation.
6. The method as claimed in claim 5 wherein:
mounting the wire-in-film adhesive the gradient density barrier having a substantially linear density progression.
7. The method as claimed in claim 5 wherein:
mounting the wire-in-film adhesive includes the gradient density barrier having a substantially exponential density progression.
8. A method of manufacture of an integrated circuit package in package system comprising:
providing a substrate having a first wire-bonded die with an active side mounted above;
connecting the active side of the first wire-bonded die to the substrate with a bond-wire;
mounting a wire-in-film adhesive having an insulating grid over the first wire-bonded die;
mounting a structure over the first wire-bonded die and the wire-in-film adhesive;
connecting the structure with the bond-wires to the substrate; and
encapsulating the first wire-bonded die, the bond-wires, and the wire-in-film adhesive with an encapsulation.