Polyconductor line end formation and related mask

1. A method of forming adjacent polyconductor line ends, the method comprising:

forming a polyconductor layer over an isolation region;

forming a mask over the polyconductor layer, the mask including a shape to create the polyconductor line ends and a correction element to ensure a designed proximity of the polyconductor line ends; and

etching the polyconductor layer using the patterned photoresist mask to create the adjacent polyconductor line ends, wherein the correction element is removed during the etching.

2. The method of claim 1 , wherein the correction element includes a bridge element spanning an opening between each shape of the mask for the polyconductor line ends.

3. The method of claim 1 , wherein the correction element includes an island positioned in an opening between each shape of the mask for the polyconductor line ends.

4. The method of claim 1 , wherein the correction element includes an element extending substantially perpendicularly to each shape of the mask for the polyconductor line ends in an opening between each shape of the mask for the polyconductor line ends.

5. The method of claim 1 , wherein the correction element includes a first element positioned to a first side of an opening between each shape of the mask for the polyconductor line ends and laterally overlapping the shapes, and a second element positioned to a second side of the opening and laterally overlapping the shapes.

6. The method of claim 1 , wherein the correction element has a dimension that is sub-resolution.

7. The method of claim 1 , wherein the correction element exists despite any optical proximity correction (OPC).

8. The method of claim 2 , wherein the mask forming includes forming a void in each shape of the mask for the polyconductor line ends.

9. A mask for forming adjacent polyconductor line ends, the mask comprising:

a shape to create each polyconductor line end;

a correction element having a dimension such that the correction element does not print during use of the mask but ensures a designed line end proximity of the polyconductor line ends, wherein the correction element includes a bridge element spanning an opening between each shape of the mask for the polyconductor line ends; and

a void in each shape of the mask for the polyconductor line ends.

10. A method of forming adjacent polyconductor line ends, the method comprising:

forming a polyconductor layer over an isolation region;

forming a mask over the polyconductor layer, the mask including a shape to create each polyconductor line end and a sub-resolution correction element to ensure a designed proximity of the polyconductor line ends, wherein the sub-resolution correction element exists despite any optical correction; and

etching the polyconductor layer using the patterned photoresist mask to create the adjacent polyconductor line ends, wherein the correction element is removed during the etching.

11. The method of claim 10 , wherein the correction element includes a bridge element spanning an opening between each shape of the mask for the polyconductor line ends.

12. The method of claim 10 , wherein the correction element includes an island positioned in an opening between each shape of the mask for the polyconductor line ends.

13. The method of claim 10 , wherein the correction element includes an element extending substantially perpendicularly to each shape of the mask for the polyconductor line ends in an opening between the shapes.

14. The method of claim 10 , wherein the correction element includes a first element positioned to a first side of an opening between each shape of the mask for the polyconductor line ends and laterally overlapping the shapes, and a second element positioned to a second side of the opening and laterally overlapping the shapes.

15. The method of claim 11 , wherein the mask forming includes forming a void in each shape of the mask for the polyconductor line ends of the mask.