Flash memory device with word lines of uniform width and method for manufacturing thereof
A method for manufacturing a semiconductor device, the method including: forming a bit line in a semiconductor substrate; forming a plurality of word lines which intersect with the bit line at predetermined intervals on the semiconductor substrate; eliminating a portion of the plurality of word lines; forming an interlayer insulating film on the semiconductor substrate; and forming a metal plug which penetrates through the interlayer insulating film and is coupled to the bit line in a region where the portion of the plurality of word lines was eliminated.
1. A method for manufacturing a semiconductor device comprising:
forming a bit line in a semiconductor substrate;
forming a plurality of word lines, the plurality of word lines intersecting with the bit line at predetermined intervals on the semiconductor substrate;
eliminating a portion of the plurality of word lines comprising a region;
forming an interlayer insulating film on the semiconductor substrate; and
forming a metal plug, wherein the metal plug penetrates through the interlayer insulating film and is coupled to the bit line in the region where the portion of the plurality of word lines was eliminated.
2. The method for manufacturing a semiconductor device according to claim 1 , further comprising:
forming a conductive layer on the semiconductor substrate; and
forming a mask layer with a pattern at predetermined intervals on the conductive layer, wherein forming the plurality of word lines comprises forming the plurality of word lines by eliminating the conductive layer using the mask layer as a mask.
3. The method for manufacturing a semiconductor device according to claim 1 , further comprising:
forming a first conductive layer on the semiconductor substrate;
forming a second conductive layer on the first conductive layer; and
forming a mask layer, the mask layer comprising a pattern at predetermined intervals on the second conductive layer, wherein forming the plurality of word lines includes forming the plurality of word lines by eliminating the first conductive layer and the second conductive layer using the mask layer as a mask.
4. The method for manufacturing a semiconductor device according to claim 3 , further comprising eliminating an area of the first conductive layer where the bit line is to be formed, wherein forming the bit line includes forming the bit line by using the first conductive layer as a mask.
5. The method for manufacturing a semiconductor device according to claim 4 , further comprising forming a first insulating layer on the bit line between the first conductive layers, wherein forming the second conductive layer includes forming the second conductive layer on the first conductive layer and the first insulating layer.
6. The method for manufacturing a semiconductor device according to claim 1 , further comprising forming second insulating layers among the plurality of word lines, wherein eliminating the portion of the word lines is performed after forming the second insulating layers.
7. The method for manufacturing a semiconductor device according to claim 1 , further comprising forming a charge storage layer on the semiconductor substrate, wherein forming the word lines includes forming the word lines on the charge storage layer.