IP Library Granted Patent US 8,037,432
Granted Patent B2
US 8,037,432 · App. 12/186,159 · Granted Oct 11, 2011

Method and apparatus for mapping design memories to integrated circuit layout

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Quick Facts
Patent No.
US 8,037,432
App. No.
12/186,159
Granted
Oct 11, 2011
Kind
B2
Abstract

A method and apparatus are provided for receiving a list of design memories, wherein each type of design memory in the list has a name and at least one instance. A pre-placement model is associated with each named memory type in the list. The design memories in the list are mapped to an integrated circuit layout pattern, wherein at least one memory type comprises first and second instances that are mapped differently from one another. After mapping, at least one of the first and second instances is renamed to have a different name than the other. A post-placement model is then associated with each named memory type in the list, including a separate model for each renamed design memory.

Claims (21)

1. A memory dis-unification tool, comprising:

a processor; and software instructions stored on a computer-readable medium, which when executed by the processor configure the tool to perform the following steps:

receiving a list of design memories, wherein each type of design memory in the list has a pre-placement name and at least one instance, and post-placement mapping information for each instance, wherein the post placement mapping information corresponds to mapping information for each instance to a pre-defined base platform slice comprising a plurality of pre-defined memory features onto which the design memories are wholly or partially mapped, including at least one memory matrix, single diffused memory, rcell memory or rcell flip-flop memory, and

renaming the type of at least one design memory instance in the list that is mapped differently than at least one other instance of the same type to a type name which is different than the pre-placement name, based on the post-placement mapping information.

2. The memory dis-unification tool of claim 1 wherein the list of design memories comprises a modified list of design memories in which an instance of a design memory type has been split into two or more different types having different type names.

3. The memory dis-unification tool of claim 1 wherein at least one of the renamed design memory instances has at least one of a unique pin placement, a unique layout, a unique number of words, a unique number of bits per word or a unique arrangement than other instances of the same type of design memory in the list.

4. The memory dis-unification tool of claim 1 , wherein the software instructions configure the tool to associate the design memory instances of the same memory type and different type names with different post-placement models.

5. A non-transitory computer-readable medium comprising instructions which, when executed on a computer perform the following steps:

a) receiving a list of design memories, wherein each type of design memory in the list has a pre-placement name and at least one instance;

b) receiving post-placement mapping information for each instance, wherein the post placement mapping information corresponds to mapping information for each instance to a pre-defined base platform slice comprising a plurality of pre-defined memory features onto which the design memories are wholly or partially mapped, including at least one memory matrix, single diffused memory, rcell memory or rcell flip-flop memory; and

c) renaming the type of the design memory instances in the list that are mapped differently than other instances of the same type, based on the post-placement mapping information.

6. The non-transitory computer-readable medium of claim 5 , wherein the list of design memories comprises a modified list of design memories in which an instance of a design memory type has been split into two or more different types having different type names.

7. The non-transitory computer-readable medium of claim 5 , wherein at least one of the renamed design memory instances has at least one of a unique pin placement, a unique layout, a unique number of words, a unique number of bits per word or a unique arrangement than other instances of the same type of design memory in the list.

8. The non-transitory computer-readable medium of claim 5 , wherein the instructions cause the computer to associate the design memory instances of the same memory type and different type names with different post-placement models.

9. A memory dis-unification system, which comprises:

means for receiving a list of design memories, wherein each type of design memory in the list has a pre-placement name and at least one instance, and post-placement mapping information for each instance, wherein the post placement mapping information corresponds to mapping information for each instance to a pre-defined base platform slice comprising a plurality of pre-defined memory features onto which the design memories are wholly or partially mapped, including at least one memory matrix, single diffused memory, rcell memory or rcell flip-flop memory; and

means, comprising at least a processor, for renaming the type of design memory instances in the list that are mapped differently than other instances of the same type, based on the post-placement mapping information.

10. The memory dis-unification system of claim 9 wherein the list of design memories comprises a modified list of design memories in which an instance of a design memory type has been split into two or more different types having different type names.

11. The memory dis-unification system of claim 9 wherein at least one of the renamed design memory instances has at least one of a unique pin placement, a unique layout, a unique number of words, a unique number of bits per word or a unique arrangement than other instances of the same type of design memory in the list.

12. The memory dis-unification system of claim 9 , further comprising:

means for associating the design memory instances of the same memory type and different type names with different post-placement models.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Apr 15, 2022
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
Reel/Frame 059720/0223 →
SECURITY INTEREST Recorded Feb 1, 2018
From: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
To: CORTLAND CAPITAL MARKET SERVICES LLC, AS COLLATERAL AGENT
Reel/Frame 045216/0020 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2017
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; BROADCOM CORPORATION
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 044887/0109 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032856-0031) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LSI CORPORATION; AGERE SYSTEMS LLC
Reel/Frame 037684/0039 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2015
From: LSI CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035390/0388 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: LSI CORPORATION; AGERE SYSTEMS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032856/0031 →