Integrated circuit package system with adhesive segment spacer

1. An integrated circuit package system comprising:

attaching an adhesive segment spacer to an interposer assembly;

mounting an integrated circuit over a carrier;

mounting the interposer assembly over the integrated circuit with the adhesive segment spacer on the interposer assembly and only on a periphery of the integrated circuit, to not extend below an integrated circuit top side, including exposing an inner region of the integrated circuit top side; and

forming an encapsulation over the integrated circuit, the interposer assembly, and the adhesive segment spacer with the interposer assembly having terminal pads exposed with a recess in the encapsulation.

2. The system as claimed in claim 1 wherein mounting the interposer assembly over the integrated circuit with the adhesive segment spacer over the periphery of the integrated circuit includes exposing a corner region of the integrated circuit.

3. The system as claimed in claim 1 further comprising:

connecting a first internal interconnect between the integrated circuit and the carrier; and

wherein mounting the interposer assembly over the integrated circuit with the adhesive segment spacer covering the periphery of the integrated circuit includes:

embedding a portion of the first internal interconnect over the integrated circuit.

4. The system as claimed in claim 1 wherein mounting the interposer assembly over the integrated circuit with the adhesive segment spacer over the periphery of the integrated circuit includes overhanging the adhesive segment spacer over the integrated circuit.

5. The system as claimed in claim 1 wherein attaching the adhesive segment spacer to the interposer assembly includes attaching a device to the adhesive segment spacer.

6. An integrated circuit package system comprising:

providing an interposer assembly having a device attached to an interposer;

attaching an adhesive segment spacer to the device;

mounting an integrated circuit over a carrier;

mounting the interposer assembly over the integrated circuit with the adhesive segment spacer on the interposer assembly and only on a periphery of the integrated circuit, to not extend below an integrated circuit top side, including exposing an inner region of the integrated circuit top side; and

forming an encapsulation over the integrated circuit, the interposer assembly, and the adhesive segment spacer with the interposer having terminal pads exposed with a recess in the encapsulation.

7. The system claimed in claim 6 wherein forming the encapsulation includes covering the inner region of the integrated circuit.

8. The system as claimed in claim 6 wherein attaching the adhesive segment spacer includes attaching a penetrable film adhesive having a B-stage characteristic.

9. The system claimed in claim 6 further comprising connecting the interposer and the carrier with a second internal interconnect.

10. The system as claimed in claim 6 further comprising mounting an external interconnect to a carrier bottom side of the carrier.

11. An integrated circuit package system comprising:

a carrier;

an integrated circuit over the carrier;

an interposer assembly over the integrated circuit;

an adhesive segment spacer on the interposer assembly and only on a periphery of the integrated circuit, to not extend below an integrated circuit top side, with an inner region of the integrated circuit not in contact with the adhesive segment spacer; and

an encapsulation over the integrated circuit, the interposer assembly, and the adhesive segment spacer with the interposer assembly having terminal pads exposed with a recess in the encapsulation.

12. The system as claimed in claim 11 wherein the adhesive segment spacer exposes a portion of a corner region of the integrated circuit.

13. The system as claimed in claim 11 further comprising:

a first internal interconnect between the integrated circuit and the carrier; and

wherein:

the adhesive segment spacer embeds a portion of the first internal interconnect over the integrated circuit.

14. The system as claimed in claim 11 wherein the adhesive segment spacer overhangs the integrated circuit.

15. The system as claimed in claim 11 wherein the interposer assembly includes a device.

16. The system as claimed in claim 11 wherein:

the interposer assembly includes a device attached to an interposer; and

the adhesive segment spacer is attached to the device.

17. The system claimed in claim 16 wherein the encapsulation is over the inner region of the integrated circuit.

18. The system as claimed in claim 16 wherein the adhesive segment spacer includes a penetrable film adhesive having a B-stage characteristic.

19. The system claimed in claim 16 further comprising a second internal interconnect connected between the interposer and the carrier.

20. The system as claimed in claim 16 further comprising an external interconnect mounted to a carrier bottom side of the carrier.