IP Library Granted Patent US 7,880,209
Granted Patent B2
US 7,880,209 · App. 12/248,257 · Granted Feb 1, 2011

MRAM cells including coupled free ferromagnetic layers for stabilization

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Quick Facts
Patent No.
US 7,880,209
App. No.
12/248,257
Granted
Feb 1, 2011
Kind
B2
Abstract

A free ferromagnetic data storage layer of an MRAM cell is coupled to a free ferromagnetic stabilization layer, which stabilization layer is directly electrically coupled to a contact electrode, on one side, and is separated from the free ferromagnetic data storage layer, on an opposite side, by a spacer layer. The spacer layer provides for the coupling between the two free layers, which coupling is one of: a ferromagnetic coupling and an antiferromagnetic coupling.

Claims (46)

1. An MRAM cell comprising:

a pinned layer having a predetermined magnetic orientation set by an adjacent antiferromagnetic pinning layer;

a spacer layer disposed between the pinned layer and a free ferromagnetic data storage layer; and

a multi-layered coupling layer disposed between the data storage layer and a free ferromagnetic stabilization layer, the coupling layer ferromagnetically coupling the data storage layer and stabilization layer in an anti-parallel magnetic relationship.

2. The MRAM cell of claim 1 , further comprising a first electrode contact layer coupled to the stabilization layer and a second electrode contact layer coupled to the antiferromagnetic pinning layer.

3. The MRAM cell of claim 1 , wherein the pinned layer comprises a synthetic antiferromagnetic coupled structure.

4. The MRAM cell of claim 1 , wherein the coupling layer further provides for spin depolarization.

5. The MRAM cell of claim 1 , wherein the coupling layer comprises an antiferromagnetic material.

6. The MRAM cell of claim 1 , wherein the coupling layer comprises a paramagnetic material.

7. The MRAM cell of claim 1 , wherein:

the coupling layer includes a first non-magnetic sub-layer and a second paramagnetic sub-layer, the second sub-layer being directly adjacent the stabilization layer.

8. The MRAM cell of claim 1 , wherein:

the coupling layer includes a first non-magnetic sub-layer and a second paramagnetic sub-layer, the second sub-layer having a thickness that is less than that of the first sub-layer.

9. The MRAM cell of claim 8 , wherein the second sub-layer is formed by doping a portion of the first sub-layer with a magnetic material.

10. The MRAM cell of claim 1 , wherein:

the coupling layer includes a first non-magnetic sub-layer and a second paramagnetic sub-layer, the second sub-layer being directly adjacent the data storage layer.

11. The MRAM cell of claim 1 , wherein:

the coupling layer includes a first non-magnetic sub-layer and a second paramagnetic sub-layer which achieves ferromagnetic coupling from interface roughness.

12. The MRAM cell of claim 11 , wherein Neel coupling arises from the interface roughness.

13. The MRAM cell of claim 1 , wherein:

the coupling layer includes a first paramagnetic sub-layer, a second non-magnetic sub-layer and a third paramagnetic sub-layer, the second sub-layer extending between the first and third sub-layers.

14. The MRAM cell of claim 1 , wherein:

the coupling layer includes a first paramagnetic sub-layer, a second non-magnetic sub-layer and a third paramagnetic sub-layer,

the first and third sub-layers each have a thickness that is less than that of the second sub-layer.

15. The MRAM cell of claim 1 , wherein:

the coupling layer includes a first non-magnetic sub-layer, a second paramagnetic sub-layer and a third non-magnetic sub-layer, the second sub-layer extending between the first and third sub-layers.

16. The MRAM cell of claim 1 , wherein:

the coupling layer includes a first non-magnetic sub-layer, a second paramagnetic sub-layer and a third non-magnetic sub-layer, the second layer having a thickness that is less than each of the first and third sub-layers.

17. An MRAM cell comprising:

a pinned layer;

an antiferromagnetic pinning layer, which pins the pinned layer;

a free ferromagnetic data storage layer;

a first spacer layer extending between the data storage layer and the pinned layer, the first spacer layer being nonmagnetic;

a free ferromagnetic stabilization layer;

a first electrode contact layer directly electrically coupled to the stabilization layer; and

a second spacer layer extending alongside the stabilization layer, opposite the first electrode contact layer and between the stabilization layer and the data storage layer, the second spacer layer including a first sub-layer and a second sub-layer, the second sub-layer having a thickness that is less than that of the first sub-layer; and

wherein the second spacer layer is conductive and provides for one of ferromagnetic coupling and antiferromagnetic coupling between the data storage layer and the stabilization layer;

the first sub-layer of the second spacer layer comprises a non-magnetic material;

the second sub-layer of the second spacer layer comprises a paramagnetic material and is formed by doping a portion of the first sub-layer with a magnetic material; and

a strength of the coupling between the data storage layer and the stabilization layer is greater than a coercivity of the stabilization layer.

18. The MRAM cell of claim 17 , further comprising a second electrode contact layer directly coupled to the antiferromagnetic pinning layer.

19. A memory element comprising:

a pinned layer having a predetermined magnetic orientation set by an adjacent pinning layer;

a spacer layer disposed between the pinned layer and a free ferromagnetic data storage layer; and

a multi-layered coupling layer disposed between the data storage layer and a free ferromagnetic stabilization layer, the coupling layer comprising at least one non-magnetic layer and at least one magnetic layer.

20. The memory element of claim 19 , wherein the non-magnetic layer has a greater thickness than the magnetic layer.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Jul 23, 2025
From: THE BANK OF NOVA SCOTIA
To: SEAGATE TECHNOLOGY PUBLIC LIMITED COMPANY; SEAGATE TECHNOLOGY; SEAGATE TECHNOLOGY HDD HOLDINGS; I365 INC.; SEAGATE TECHNOLOGY LLC; SEAGATE TECHNOLOGY INTERNATIONAL; SEAGATE HDD CAYMAN; SEAGATE TECHNOLOGY (US) HOLDINGS, INC.
Reel/Frame 072193/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 25, 2019
From: SEAGATE TECHNOLOGY LLC
To: EVERSPIN TECHNOLOGIES, INC.
Reel/Frame 050483/0188 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS Recorded Jul 19, 2013
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT AND SECOND PRIORITY REPRESENTATIVE
To: SEAGATE TECHNOLOGY LLC; EVAULT INC. (F/K/A I365 INC.); SEAGATE TECHNOLOGY INTERNATIONAL; SEAGATE TECHNOLOGY US HOLDINGS, INC.
Reel/Frame 030833/0001 →
SECURITY AGREEMENT Recorded Mar 24, 2011
From: SEAGATE TECHNOLOGY LLC
To: THE BANK OF NOVA SCOTIA, AS ADMINISTRATIVE AGENT
Reel/Frame 026010/0350 →
RELEASE Recorded Jan 19, 2011
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: SEAGATE TECHNOLOGY HDD HOLDINGS; MAXTOR CORPORATION; SEAGATE TECHNOLOGY LLC; SEAGATE TECHNOLOGY INTERNATIONAL
Reel/Frame 025662/0001 →
SECURITY AGREEMENT Recorded May 15, 2009
From: MAXTOR CORPORATION; SEAGATE TECHNOLOGY LLC; SEAGATE TECHNOLOGY INTERNATIONAL
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT AND FIRST PRIORITY REPRESENTATIVE; WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT AND SECOND PRIORITY REPRESENTATIVE
Reel/Frame 022757/0017 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 9, 2008
From: XI, HAIWEN; GAO, KAIZHONG; DIMITROV, DIMITAR V.; XUE, SONG S.
To: SEAGATE TECHNOLOGY LLC
Reel/Frame 021655/0891 →