IP Library Granted Patent US 7,839,671
Granted Patent B2
US 7,839,671 · App. 12/290,179 · Granted Nov 23, 2010

Resistive memory cell array with common plate

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Quick Facts
Patent No.
US 7,839,671
App. No.
12/290,179
Granted
Nov 23, 2010
Kind
B2
Abstract

In the present method of changing the state of a resistive memory device which is capable of adopting an erased, relatively higher resistance state and a programmed, relatively lower resistance state, the resistive memory device having first and second electrodes and an active layer between the first and second electrodes, an electrical potential is applied across the electrodes and current through the resistive memory device is limited by means of a first current limiting structure to change the resistive memory device from the erased, higher resistance state to the programmed, lower resistance state. Furthermore, an electrical potential is applied across the electrodes and current through the resistive memory device is limited by means of a second current limiting structure to change the resistive memory device from the programmed, lower resistance state to the erased, higher resistance state.

Claims (26)

1. A memory structure comprising:

a resistive memory device;

a transistor;

a word line connected to the gate of the transistor;

a bit line;

one terminal of the transistor being connected to the resistive memory device, the other terminal of the transistor being connected to the bit line; and

first and second current source/limiting structures connected to the bit line.

2. The memory structure of claim 1 and further comprising a sense amplifier connected to the bit line.

3. A memory array comprising:

a plurality of word lines;

a plurality of bit lines;

a plurality of memory structures, each comprising a transistor and a resistive memory device, the resistive memory device comprising first and second electrodes and an active layer between the first and second electrodes, one terminal of the transistor being connected to a bit line, the other terminal of the transistor being connected to the first electrode of the resistive memory device, the gate of the transistor being connected to a word line, the second electrodes of the resistive memory devices being connected in common, wherein first and second current source/limiting structures are connected to each bit line.

4. The memory device of claim 3 wherein the second electrodes are connected by means of a common plate.

5. The memory device of claim 4 wherein the second electrodes are part of the common plate.

6. A memory device comprising:

a substrate;

a common plate over the substrate;

a plurality of resistive memory devices over the substrate, wherein the common plate makes part of each of the resistive memory devices; and

a bit line overlying the substrate, the common plate overlying the bit line, wherein first and second current source/limiting structures are connected to the bit line.

7. The memory device of claim 6 and further comprising a transistor comprising a source and a drain in the substrate, and a gate, the common plate overlying the transistor.

8. The memory device of claim 7 wherein the transistor is in operative association with a resistive memory device.

9. The memory device of claim 8 wherein the gate of the transistor is a word line, the common plate overlying the word line.

10. The memory device of claim 3 and further comprising a sense amplifier communicatively coupled to each bit line.

11. The memory device of claim 6 and further comprising a sense amplifier communicatively coupled to the bit line.

12. The memory device of claim 6 wherein an electrode of each resistive memory device is connected by means of the common plate.

13. The memory device of claim 12 wherein the electrode of each resistive memory device is part of the common plate.

Assignments (7)
CORRECTIVE ASSIGNMENT TO CORRECT THE 8647899 PREVIOUSLY RECORDED ON REEL 035240 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTERST. Recorded Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 14, 2016
From: CYPRESS SEMICONDUCTOR CORPORATION
To: MONTEREY RESEARCH, LLC
Reel/Frame 040911/0238 →
PARTIAL RELEASE OF SECURITY INTEREST IN PATENTS Recorded Aug 11, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 039708/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 1, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036050/0001 →
SECURITY INTEREST Recorded Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
RELEASE OF SECURITY INTEREST Recorded Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
SECURITY AGREEMENT Recorded Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →