Die offset die to bonding
A semiconductor die is provided on a spacer, the die having first and second opposite edges which extend beyond respective first and second opposite edges of the spacer, the first edge of the die extending beyond the first edge of the spacer to a lesser extent than the second edge of the die extends beyond the second edge of the spacer. Furthermore, a first semiconductor die has a plurality of bond pads thereon, a second semiconductor die has a plurality of bond pads thereon, and a substrate has a plurality of bond pads thereon. Each of a first plurality of wires connects a bond pad on the first semiconductor die with a bond pad on the second semiconductor die, and each of a second plurality of wires connects a bond pad on the second semiconductor die with a bond pad on the substrate.
1. A method of fabricating an electronic device comprising:
providing a substrate;
providing a single spacer;
providing first and second semiconductor integrated circuit die, the first semiconductor integrated circuit die being on the single spacer, the single spacer being on the second semiconductor integrated circuit die, and the second semiconductor integrated circuit die being on the substrate wherein the dimensions of the single spacer are smaller than those of the first semiconductor integrated circuit die and the first semiconductor integrated circuit die is the topmost component in a stack wherein the single spacer is offset from the center of the first semiconductor integrated circuit die;
providing wires connecting bond pads on the first semiconductor integrated circuit die with bond pads on the second semiconductor integrated circuit die, and connecting bond pads on the second semiconductor integrated circuit die with bond pads on the substrate.
2. The method of claim 1 wherein the wires connecting bond pads on the first semiconductor integrated circuit die with bond pads on the second semiconductor integrated circuit die are applied in the direction from the bond pads on the first semiconductor integrated circuit die toward the bond pads on the second semiconductor integrated circuit die.
3. The method of claim 2 wherein the wires connecting bond pads on the second semiconductor integrated circuit die with bond pads on the substrate are applied in the direction from the bond pads on the second semiconductor integrated circuit die toward the bonds pads on the substrate.