Integrated circuit package system with leadfinger support
View Patent ↗An integrated circuit package system including forming a leadframe having a lead with a leadfinger support of a predetermined height, and attaching an integrated circuit die with an electrical interconnect at a predetermined collapse height determined by the predetermined height of the leadfinger support.
1. An integrated circuit package system comprising:
a leadframe having a lead with a leadfinger support of a predetermined height, the leadfinger support formed from the lead; and
an integrated circuit die with an electrical interconnect in contact with a vertical side of the leadfinger support and at a collapse height determined by the predetermined height of the leadfinger support.
2. The system as claimed in claim 1 wherein the leadframe comprises a wetting surface to control the spread distance of the electrical interconnect.
3. The system as claimed in claim 1 wherein the leadfinger support is a protruding stud.
4. The system as claimed in claim 1 wherein the leadfinger support is a protruding shape.
5. The system as claimed in claim 1 wherein the integrated circuit die comprises the electrical interconnect around the leadfinger support and on a wetting surface.
6. The system as claimed in claim 1 wherein the leadframe is a leadframe with a leadfinger support of a predetermined height providing control of a collapse height and a wetting surface providing control of a spread distance, and wherein the integrated circuit die is an integrated circuit die with an active surface having an electrical interconnect, and further comprising:
the electrical interconnect aligned with the leadfinger support and the integrated circuit die on the leadframe at the collapse height and the spread distance.
7. The system as claimed in claim 6 wherein the leadframe comprises an inner tip of the lead with a reduced height for the wetting surface and a protruded portion for the leadfinger support.
8. The system as claimed in claim 6 wherein the leadframe comprises an inner tip of the lead having more than one protruded portion of the leadfinger support.
9. The system as claimed in claim 6 wherein the integrated circuit die on the leadframe comprises the electrical interconnect around the leadfinger support and over the wetting surface.
10. The system as claimed in claim 6 wherein the integrated circuit die on the leadframe comprises the integrated circuit die along both the horizontal plane and vertical axes with the leadfinger support.