Integrated circuit package system with slotted die paddle and method of manufacture thereof

1. A method of manufacture of an integrated circuit package system comprising:

providing a selective slot die paddle having selective slots and edge pieces around the perimeter including half etching a tie bar for supporting the selective slot die paddle;

providing extended leads protruding into the selective slots;

mounting an integrated circuit die on the selective slot die paddle; and

coupling bond wires between the integrated circuit die, the edge pieces, the extended leads, or a combination thereof.

2. The method as claimed in claim 1 further comprising forming a plated region on the selective slot die paddle.

3. The method as claimed in claim 1 further comprising:

forming a plated lead region on the surface of the extended leads; and

providing a lead locking feature on the edges of the extended lead.

4. The method as claimed in claim 1 further comprising forming a molding compound on the selective slot die paddle, the integrated circuit die, the bond wires, and the extended leads.

5. The method as claimed in claim 1 further comprising:

forming a deep selective slot in the selective slot die paddle; and

providing a second extended lead protruding into the deep selective slot.

6. A method of manufacture of an integrated circuit package system comprising:

providing a selective slot die paddle having selective slots and edge pieces around the perimeter including half etching a tie bar for supporting the selective slot die paddle;

providing extended leads protruding into the selective slots including providing leads adjacent to the extended leads;

mounting an integrated circuit die on the selective slot die paddle including aligning pads with the extended leads; and

coupling bond wires between the integrated circuit die, the edge pieces, the extended leads, or a combination thereof including coupling the pads to the leads.

7. The method as claimed in claim 6 further comprising forming a plated region on the selective slot die paddle including depositing a metal in the plated region.

8. The method as claimed in claim 6 further comprising:

forming a plated lead region on the surface of the extended leads including depositing a metal on the leads and the extended leads; and

providing a lead locking feature on the edges of the extended lead including surrounding a second extended lead by the lead locking feature.

9. The method as claimed in claim 6 further comprising forming a molding compound on the selective slot die paddle, the integrated circuit die, the bond wires, and the extended leads including forming a planar surface including the leads, the extended leads, the selective slot die paddle, by the molding compound.

10. The method as claimed in claim 6 further comprising:

forming a deep selective slot in the selective slot die paddle wherein forming the deep selective slot includes a recess in the selective slot die paddle, beyond a half etched edge; and

providing a second extended lead protruding into the deep selective slot.

11. An integrated circuit package system comprising:

a selective slot die paddle having selective slots and edge pieces around the perimeter includes a tie bar, half etched, for supporting the selective slot die paddle;

extended leads protruding into the selective slots;

an integrated circuit die mounted on the selective slot die paddle; and

bond wires coupled between the integrated circuit die, the edge pieces, the extended leads, or a combination thereof.

12. The system as claimed in claim 11 further comprising a plated region on the selective slot die paddle.

13. The system as claimed in claim 11 further comprising:

a plated lead region on the surface of the extended leads; and

a lead locking feature on the edges of the extended lead.

14. The system as claimed in claim 11 further comprising a molding compound formed on the selective slot die paddle, the integrated circuit die, the bond wires, and the extended leads.

15. The system as claimed in claim 11 further comprising:

a deep selective slot in the selective slot die paddle; and

a second extended lead protruding into the deep selective slot.

16. The system as claimed in claim 11 further comprising:

a tie bar for supporting the selective slot die paddle;

leads adjacent to the extended leads; and

pads aligned with the extended leads and coupled by the bond wires.

17. The system as claimed in claim 16 further comprising a plated region on the selective slot die paddle including a metal deposited in the plated region.

18. The system as claimed in claim 16 further comprising:

a plated lead region on the surface of the extended leads includes a metal deposited on the leads and the extended leads; and

a lead locking feature on the edges of the extended lead includes a second extended lead surrounded by the lead locking feature.

19. The system as claimed in claim 16 further comprising a molding compound formed on the selective slot die paddle, the integrated circuit die, the bond wires, and the extended leads includes a planar surface including the leads, the extended leads, the selective slot die paddle, by the molding compound.

20. The system as claimed in claim 16 further comprising:

a deep selective slot in the selective slot die paddle wherein the deep selective slot includes a recess in the selective slot die paddle beyond a half etched edge; and

a second extended lead protruding into the deep selective slot.