Imaging device having a radiation detecting structure disposed at a semiconductor substrate with a thermalizing material and a first radiation-reactive material sensitive to neutron radiation
View Patent ↗An imaging device suitable for detecting certain imaging particles and recording the detection of imaging particles, and as such can include certain recording devices such as a charge storage structure.
1. A device comprising:
a first radiation-detecting structure disposed at a semiconductor substrate comprising a thermalizing material, the first radiation-detecting structure comprising a first radiation-reactive material sensitive to neutron radiation.
2. The device of claim 1 , wherein the first radiation detecting structure comprises a charge storage structure, the charge storage structure disposed between the thermalizing material and a second thermalizing material.
3. The device of claim 1 , wherein the thermalizing material comprises a material selected from the group consisting of hydrogen-containing materials, deuterium-containing materials, and carbon-containing materials.
4. The device of claim 1 , wherein the thermalizing material comprises a polymer selected from the group of polymers consisting of polyolefins, polyamides, polyimides, polyesters, polystyrenes, polycarbonates, polyurethanes, polyethers, polysulphones, polyvinyls, and polyactic acids, or a combination thereof.
5. The device of claim 1 , wherein the first radiation-detecting structure further comprises a second radiation-reactive material sensitive to a second radiation type.
6. The device of claim 1 further comprising:
a base;
the substrate overlying at least a portion of the base, and the radiation-detecting structure including an array of charge storage structures at the substrate.
7. The device of claim 6 , wherein the radiation-detecting structure comprises a memory array comprising the array of charge storage structures.
8. The device of claim 7 , wherein each of the charge storage structures within the array of charge storage structures comprise a conductive charge storage layer.
9. The device of claim 7 , wherein each of the charge storage structures within the array of charge storage structures comprise a non-conductive charge storage layer.
10. The device of claim 7 , wherein each of the charge storage structures within the array of charge storage structures comprise a nitrogen-containing layer disposed between and in direct contact with an underlying dielectric layer and an overlying dielectric layer.
11. The device of claim 6 , wherein the substrate is disposed within an interior space within the base.
12. The device of claim 6 , wherein the substrate has a diameter of at least about 10 cm.
13. The device of claim 6 , wherein the substrate has an average thickness within a range between about 1 mm and about 5 mm.
14. The device of claim 6 , further comprising a cover overlying the radiation-detecting structure.
15. The device of claim 14 , wherein the cover is an interposer to provide electrical connections between the radiation-detecting structure and an external contact of the interposer.
16. A device comprising:
a first radiation-detecting structure comprising a charge-storage structure and a neutron radiation-reactive material; and
a second radiation-detecting structure comprising a charge-storage structure electrically coupled to the first radiation-detecting structure.
17. The device of claim 16 , wherein the first radiation-detecting structure is part of a first substrate and the second radiation-detecting structure is part of a second substrate, wherein the first substrate and second substrate are different substrates.
18. The device of claim 17 , further comprising a housing, the housing containing a plurality of substrates, each substrate of the plurality of substrates comprising a plurality of radiation-detecting structures.
19. The device of claim 18 , wherein the array of radiation-detecting structures define a major plane of each respective substrate, and wherein each major plane of the respective substrates are coplanar with each other.
20. The device of claim 19 , further comprising a thermalizing material disposed between each of the substrates of the plurality of substrates.