Integrated circuit packaging system with isolated pads and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit die packaging system includes: providing a lead frame having a die attach paddle, an isolated pad, and a connector; attaching an integrated circuit die to the die attach paddle and the connector; forming an encapsulation over the integrated circuit die, the connector, the die attach paddle, and the isolated pad; and singulating the connector and the die attach paddle whereby the isolated pads are electrically isolated.
1. A method of manufacture of an integrated circuit packaging system comprising:
providing a lead frame having a die attach paddle, an isolated pad, and a connector;
attaching an integrated circuit die to the die attach paddle and the connector;
forming an encapsulation over the integrated circuit die, the connector, the die attach paddle, and the isolated pad; and
singulating the connector and the die attach paddle includes removing a portion of a fused connector attached to the isolated pad and a dam bar whereby the isolated pads are electrically isolated.
2. The method as claimed in claim 1 wherein singulating the connector and the die attach paddle includes removing a portion of a tie bar attached to the isolated pad and the die attach paddle.
3. The method as claimed in claim 1 wherein singulating the connector and the die attach paddle includes removing a portion of a connecting bar attached to the isolated pad and a second isolated pad.
4. The method as claimed in claim 1 wherein singulating the connector and the die attach paddle includes removing a portion of a fused connector attached to the isolated pad, the isolated pad formed with a down set from the fused connector.
5. A method of manufacture of an integrated circuit packaging system comprising:
providing a lead frame having a die attach paddle, an isolated pad, and a connector;
mounting an integrated circuit die to the die attach paddle;
attaching an electrical interconnect to the integrated circuit die, the isolated pad, and the connector;
forming an encapsulation over the integrated circuit die, the connector, the die attached paddle, and the isolated pad; and
singulating the connector and the die attach paddle includes removing a portion of a fused connector attached to the isolated pad and a dam bar whereby the isolated pads are electrically isolated.
6. The method as claimed in claim 5 wherein forming an encapsulation includes forming an encapsulation providing a side of the isolated pad substantially exposed.
7. The method as claimed in claim 5 wherein forming an encapsulation includes forming an encapsulation providing a side of the die attach pad substantially exposed.
8. The method a claimed in claim 5 wherein forming an encapsulation includes forming an encapsulation providing a side of the isolated pad substantially exposed and a side of the die attach pad substantially exposed.
9. The method as claimed in claim 5 further comprising forming a second isolated pad separated from the isolated pad by a cavity.