Semiconductor device and programming method

1. A method for fabricating a semiconductor device comprising:

mounting a semiconductor chip on a chip mounting portion;

disposing a sheet-shaped resin at a side of the semiconductor chip opposite to the chip mounting portion, wherein disposing the sheet-shaped resin comprises disposing the sheet-shaped resin on a surface of a die to seal the semiconductor chip, the surface opposing the semiconductor chip; and

forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip.

2. The method as claimed in claim 1 , wherein forming the resin sealing portion includes:

disposing an uncured resin between the sheet-shaped resin and the semiconductor chip; and

sealing the semiconductor chip by the uncured resin.

3. The method as claimed in clam 1 , wherein forming the resin sealing portion is forming the resin sealing portion by transfer molding.

4. The method as claimed in clam 1 , wherein the sheet-shaped resin does not include a filler.

5. The method as claimed in clam 1 , wherein forming the resin sealing portion includes partially forming the resin sealing portion between the sheet-shaped resin and the semiconductor chip.

6. The method as claimed in clam 1 , wherein disposing the sheet-shaped resin is disposing the sheet-shaped resin in contact with the semiconductor chip.

7. The method as claimed in clam 1 , wherein the semiconductor chip has stacked semiconductor chips.

8. The method as claimed in clam 1 , further comprising:

coupling a wire between the semiconductor chip and the chip mounting portion, wherein the wire is provided in contact with the sheet-shaped resin portion.

9. The method as claimed in clam 1 further comprising:

coupling a wire between the semiconductor chip and the chip mounting portion, wherein the wire is partially embedded in the sheet-shaped resin portion.

10. A system comprising:

means for mounting a semiconductor chip on a chip mounting portion;

means for disposing a sheet-shaped resin at a side of the semiconductor chip opposite to the chip mounting portion, wherein the disposing of the sheet-shaped resin comprises disposing the sheet-shaped resin on a surface of a die to seal the semiconductor chip, the surface opposing the semiconductor chip; and

means for forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip.

11. The method as claimed in claim 10 , wherein the means for forming the resin sealing portion includes:

means for disposing an uncured resin between the sheet-shaped resin and the semiconductor chip; and

means for sealing the semiconductor chip by the uncured resin.

12. The method as claimed in clam 10 , wherein the resin sealing portion is formed by transfer molding.

13. The method as claimed in clam 10 , wherein the sheet-shaped resin does not include a filler.

14. The method as claimed in clam 10 , wherein forming the resin sealing portion includes partially forming the resin sealing portion between the sheet-shaped resin and the semiconductor chip.

15. The method as claimed in clam 10 , wherein disposing the sheet-shaped resin is disposing the sheet-shaped resin in contact with the semiconductor chip.

16. The method as claimed in clam 10 , wherein the semiconductor chip has stacked semiconductor chips.

17. A method for fabricating a semiconductor device comprising:

mounting a semiconductor chip on an upper die portion;

disposing a sheet-shaped resin on a lower die portion, wherein the sheet-shaped resin is opposite to the semiconductor chip, wherein the disposing of the sheet-shaped resin comprises disposing the sheet-shaped resin on a surface of a die to seal the semiconductor chip, the surface opposing the semiconductor chip; and

assembling the upper die portion and the lower die portion; and

sealing the semiconductor chip with a sealing resin, wherein the sealing resin forms a resin sealing portion between the sheet-shaped resin and the upper die portion, to seal the semiconductor chip.

18. The method as claimed in claim 17 , further comprising:

coupling a wire between the semiconductor chip and the chip mounting portion, wherein the wire is provided in contact with the sheet-shaped resin portion.