Encapsulant cavity integrated circuit package system and method of fabrication thereof
View Patent ↗A method for fabricating an encapsulant cavity integrated circuit package system includes: forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, and attaching a component on the interposer in the encapsulant cavity.
1. A method for fabricating an encapsulant cavity integrated circuit package system comprising:
mounting a first integrated circuit on a first surface of an interposer;
molding a first encapsulant over the first integrated circuit forming a first integrated circuit package;
mounting the first integrated circuit package with an inverted bottom terminal over a substrate;
molding a second encapsulant over the first integrated circuit package with the inverted bottom terminal and the substrate forming an encapsulant cavity having a second surface of the interposer substantially exposed; and
mounting a component on the second surface of the interposer in the encapsulant cavity.
2. The method as claimed in claim 1 wherein mounting the component comprises mounting passive devices on the second surface of the interposer in the encapsulant cavity.
3. The method as claimed in claim 1 wherein mounting the component comprises attaching a leaded package on the second surface of the interposer in the encapsulant cavity.
4. The method as claimed in claim 1 wherein mounting the component comprises attaching a leadless package on the second surface of the interposer in the encapsulant cavity.
5. The method as claimed in claim 1 wherein mounting the component comprises:
mounting an optical sensor device on the second surface of the interposer in the encapsulant cavity; and
attaching an optical lid over the optical sensor device and the encapsulant cavity.
6. An encapsulant cavity integrated circuit package system comprising:
a first integrated circuit package includes a first integrated circuit on a first surface of an interposer with an inverted bottom terminal; a first encapsulant over the first integrated circuit forming the first integrated circuit package; the first integrated circuit package with the inverted bottom terminal over a substrate; a second encapsulant over the first integrated circuit package with the inverted bottom terminal and the substrate forming an encapsulant cavity having a second surface of the interposer substantially exposed;
a component on the interposer in the encapsulant cavity; and the component is on the second surface of the interposer in the encapsulant cavity.
7. The system as claimed in claim 6 wherein the component comprises system device packages having surface-mount package technology.
8. The system as claimed in claim 6 wherein the component comprises system devices having chip-scale package technology.
9. The system as claimed in claim 6 wherein the component comprises passive devices on the second surface of the interposer in the encapsulant cavity.
10. The system as claimed in claim 6 wherein the component comprises a leaded package on the second surface of the interposer in the encapsulant cavity.
11. The system as claimed in claim 6 wherein the component comprises a leadless package on the second surface of the interposer in the encapsulant cavity.
12. The system as claimed in claim 9 wherein the component comprises:
an optical sensor device on the second surface of the interposer in the encapsulant cavity; and
an optical lid over the optical sensor and the encapsulant cavity.