Substrate for electrical component and method
Insulating substrates may be selectively removed to form electrical connections between conductive patterns on different faces of the insulating substrate or between conductive patterns on the insulating substrate and external circuits.
1. An electrical component comprising:
an insulating substrate having a first face and a second face opposite the first face;
a plurality of first electrodes formed entirely on the first face of the substrate;
a plurality of conductive tracks on the first face, the plurality of conductive tracks adapted to connect the plurality of first electrodes to external circuitry;
a first conductive pattern of a touch position-sensing panel on the first face, the first conductive pattern having a rear surface facing the insulating substrate and a front surface opposite the rear surface, the first conductive pattern adapted to electronically couple to the external circuitry;
a second conductive pattern of the touch position-sensing panel on the second face, the second conductive pattern comprising at least in part a plurality of second electrodes formed entirely on the second face of the substrate, the plurality of first electrodes on the first face configured to capacitively couple to corresponding electrodes of the plurality of second electrodes on the second face;
a recess passing through the insulating substrate to the first and second faces of the insulating substrate; and
a conductive material located within the recess and forming a conductive connection between the first and second conductive patterns, the conductive connection electronically coupling at least one of the plurality of second electrodes to at least a portion of the first conductive pattern for connecting the at least one of the plurality of second electrodes to the external circuitry via the at least a portion of the first conductive pattern on the first face.
2. The electrical component of claim 1 , wherein a surface of the conductive material is parallel with the plane of the first conductive pattern.
3. The electrical component of claim 1 , wherein the conductive material is at least one material selected from the group consisting of: solder, silverloaded epoxy and printable carbon ink.
4. The electrical component of claim 1 , wherein the substrate is comprised of one material selected from the group consisting of: polycarbonate and polyethylene terephthalate.
5. The electrical component of claim 1 , wherein the plurality of conductive tracks is a plurality of first conductive tracks and the electrical component further comprises a plurality of second conductive tracks extending across the second face of the insulating substrate, the plurality of second conductive tracks adapted to connect the second conductive pattern to circuitry.
6. The electrical component of claim 1 , wherein the conductive material extends through the opening of the second conductive pattern such that the conductive material extends over and contacts at least some of a front surface of the second conductive pattern, the front surface of the second conductive pattern facing away from the insulating substrate.