IP Library Granted Patent US 8,716,753
Granted Patent B2
US 8,716,753 · App. 12/963,510 · Granted May 6, 2014

Nitride semiconductor material, semiconductor element, and manufacturing method thereof

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Quick Facts
Patent No.
US 8,716,753
App. No.
12/963,510
Granted
May 6, 2014
Kind
B2
Abstract

The nitride semiconductor material according to the present invention includes a group III nitride semiconductor and a group IV nitride formed on the group III nitride semiconductor, where an interface between the group III nitride semiconductor and the group IV nitride has a regular atomic arrangement. Moreover, an arrangement of nitrogen atoms of the group IV nitride in the interface and an arrangement of group III atoms of the group III nitride semiconductor in the interface may be substantially identical.

Claims (41)

1. A nitride semiconductor material comprising:

a group III nitride semiconductor; and

a group IV nitride formed on said group III nitride semiconductor,

wherein an interface between said group III nitride semiconductor and said group IV nitride has a regular atomic arrangement,

in the interface, a nitrogen plane of said group IV nitride is in contact with a group III plane of said group III nitride semiconductor,

in said group III nitride semiconductor, an electrical conduction is a p-type,

a lattice constant of said group IV nitride is small compared to a lattice match condition with said group III nitride semiconductor,

in said group IV nitride, a hole which reaches the interface is formed, and

said nitride semiconductor material further includes a conductive material connected with the interface via the hole.

2. The nitride semiconductor material according to claim 1 ,

wherein an arrangement of nitrogen atoms of said group IV nitride in the interface and an arrangement of group III atoms of said group III nitride semiconductor in the interface are substantially identical.

3. The nitride semiconductor material according to claim 1 ,

wherein said group IV nitride semiconductor has a beta-phase or a gamma-phase crystal structure in the interface.

4. The nitride semiconductor material according to claim 1 ,

wherein said group III nitride semiconductor has a (0001) plane of a wurtzite structure or a (111) plane of a zinc-blende structure in the interface,

said group IV nitride has a (0001) plane of a beta-phase crystal structure in the interface,

a <11-20> direction of the (0001) plane of the wurtzite structure or a <11-2> direction of the (111) plane of the zinc-blende structure of said group III nitride semiconductor matches with a <11-20> direction of the (0001) plane of the beta-phase crystal structure of said group IV nitride, and

a lattice constant of said group IV nitride is roughly twice a lattice constant of said group III nitride semiconductor.

5. The nitride semiconductor material according to claim 1 ,

wherein said group III nitride semiconductor includes:

a first layer made of gallium nitride; and

a second layer formed on said first layer, and made of a group III nitride semiconductor having a wide band gap compared to gallium nitride, and

said group IV nitride is formed on said second layer.

6. The nitride semiconductor material according to claim 1 ,

wherein, said group IV nitride contains a group IV element and nitrogen in a 3:4 ratio, and having a margin of error that is within 10 percent for composition of the group IV element and the nitrogen.

7. The nitride semiconductor material according to claim 1 ,

wherein said group IV nitride contains hydrogen.

8. The nitride semiconductor material according to claim 1 ,

wherein said group IV nitride semiconductor has a regular atomic arrangement throughout a whole area of said group IV nitride semiconductor.

9. A semiconductor element comprising:

a group III nitride semiconductor;

a group IV nitride formed on said group III nitride semiconductor;

a source electrode formed on said group III nitride semiconductor;

a drain electrode formed on said group III nitride semiconductor, opposite said source electrode; and

a gate electrode formed on said group IV nitride, between said source electrode and said drain electrode,

wherein an interface between said group III nitride semiconductor and said group IV nitride has a regular atomic arrangement,

in the interface, a nitrogen plane of said group IV nitride is in contact with a group III plane of said group III nitride semiconductor,

said group III nitride semiconductor has a p-type group III nitride semiconductor,

said group IV nitride is formed between said p-type group III nitride semiconductor and said gate electrode,

in said group IV nitride, a hole which reaches said p-type group III nitride semiconductor is formed, and

said gate electrode is connected to said p-type group III nitride semiconductor via the hole.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 4, 2025
From: INFINEON TECHNOLOGIES AUSTRIA AG
To: PANASONIC HOLDINGS CORPORATION
Reel/Frame 072853/0508 →
CHANGE OF NAME Recorded Dec 13, 2024
From: PANASONIC CORPORATION
To: PANASONIC HOLDINGS CORPORATION
Reel/Frame 069631/0392 →