IP Library Granted Patent US 9,218,561
Granted Patent B2
US 9,218,561 · App. 13/115,340 · Granted Dec 22, 2015

Touch sensor with RFID

Inventor: Esat Yilmaz (Santa Cruz, CA)
Assignee: Atmel Corporation
G06K19/07758
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Quick Facts
Patent No.
US 9,218,561
App. No.
13/115,340
Granted
Dec 22, 2015
Kind
B2
Abstract

The examples describe the integration of a RFID tag with a touch sensor.

Claims (32)

1. A panel comprising: at least one substrate having a main portion that includes a sensing area and a peninsula portion that is separate from and outside the sensing area of the main portion; a plurality of electrodes on the at least one substrate disposed within the sensing area of the main portion of the at least one substrate and arranged to sense touch of an object within the sensing area; and a radio-frequency identification (RFID) tag disposed on the peninsula portion of the at least one substrate, wherein an antenna portion of the RFID tag does not overlap, in plan view on a common side of the at least one substrate, one or more connecting lines for connecting one or more of the plurality of electrodes to a controller disposed on a flexible printed circuit board coupled to the at least one substrate, the flexible printed circuit board being distinct from the peninsula portion of the at least one substrate.

2. The panel of claim 1 wherein the RFID tag is selected from the group consisting of an active RFID tag, a passive RFID tag, and a semi-passive RFID tag.

3. The panel of claim 1 wherein the plurality of electrodes are on a same substrate surface.

4. The panel of claim 1 wherein the plurality of electrodes comprise a drive electrode on a first surface of the at least one substrate and a sense electrode on another surface of the at least one substrate.

5. The panel of claim 1 wherein the plurality of electrodes and the RFID tag are disposed on the same surface of the at least one substrate.

6. The sensing panel of claim 1 wherein the peninsula portion of the substrate is folded underneath the main portion of the substrate.

7. A device comprising:

a panel, the panel comprising:

at least one substrate having a main portion that includes a sensing area and a peninsula portion that is separate from and outside the sensing area of the main portion;

a plurality of electrodes on the at least one substrate disposed within the sensing area of the main portion of the at least one substrate and configured to sense touch of an object within the sensing area; and

a radio-frequency identification (RFID) tag having an antenna portion disposed at least in part on the peninsula portion of the at least one substrate; and

control circuitry disposed on a flexible printed circuit board coupled to the at least one substrate, the flexible printed circuit board being distinct from the peninsula portion of the at least one substrate, the control circuitry configured to communicate with the electrodes, and to sense the touch of an object within the sensing panel;

wherein the antenna portion of the RFID tag does not overlap, in plan view on a common side of the at least one substrate, one or more connecting lines for connecting one or more of the plurality of electrodes to the control circuitry, the antenna portion of the RFID tag being coupled to the control circuitry disposed on the flexible printed circuit board.

8. The device of claim 7 wherein the plurality of electrodes are on a same substrate surface.

9. The device of claim 7 wherein the plurality of electrodes comprise a drive electrode on a first surface of the at least one substrate and a sense electrode on another surface of the at least one substrate.

10. The device of claim 7 wherein the plurality of electrodes and the RFID tag are disposed on the same surface of the at least one substrate.

11. The device of claim 7 wherein the peninsula portion of the substrate is folded underneath the main portion of the substrate.

12. An electronic device comprising: a touch sensor disposed in a housing of the electronic device, the touch sensor comprising: a sensing panel, the sensing panel comprising: a substrate having a main portion that includes a sensing area and a peninsula portion that is separate from and outside the sensing area of the main portion; and a plurality of electrodes on the substrate disposed within the sensing area of the main portion of the substrate and configured to sense the presence of an object; a radio-frequency identification (RFID) tag disposed on the peninsula portion of the at least one substrate; and control circuitry disposed on a flexible printed circuit board coupled to the substrate, the flexible printed circuit board being distinct from the peninsula portion of the substrate, the control circuitry configured to communicate with the sensing panel, and to sense the presence of an object in proximity to the sensing panel; wherein an antenna portion of the RFID tag does not overlap, in plan view on a common side of the at least one substrate, one or more connecting lines for connecting one or more of the plurality of electrodes to the control circuitry.

13. The electronic device of claim 12 wherein the RFID tag is selected from the group consisting of a passive RFID tag, an active RFID tag, and a semi-passive RFID tag.

14. The electronic device of claim 12 wherein the plurality of electrodes are on a same surface of the substrate.

15. The electronic device of claim 12 wherein the plurality of electrodes comprise a drive electrode on a first surface of the substrate and a sense electrode on another surface of the substrate.

16. The electronic device of claim 12 wherein the plurality of electrodes and the RFID tag are disposed on the same surface of the substrate.

17. The electronic device of claim 12 wherein the peninsula portion of the substrate is folded underneath the main portion of the substrate.

18. A panel comprising:

at least one substrate having a main portion that includes a sensing area;

a flexible printed circuit board bonded to a portion of the substrate;

a plurality of electrodes on the at least one substrate disposed within the sensing area of the main portion of the at least one substrate and arranged to sense touch of an object within the sensing area; and

a radio-frequency identification (RFID) tag disposed on the flexible printed circuit board and not on the at least one substrate, at least a portion of an antenna portion of the RFID tag being disposed on a peninsula portion of the flexible printed circuit board, wherein the antenna portion of the RFID tag does not overlap, in plan view on a common side of the at least one substrate, one or more connecting lines for connecting one or more of the plurality of electrodes to a controller.

19. The panel of claim 18 wherein the RFID tag is selected from the group consisting of an active RFID tag, a passive RFID tag, and a semi-passive RFID tag.

20. The device of claim 7 wherein the control circuitry disposed on the flexible printed circuit board comprises:

a first control unit configured to communicate with the electrodes, and to sense the touch of an object within the sensing panel; and

a second control unit to which the antenna portion of the RFID tag is coupled.

Assignments (13)
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: ATMEL CORPORATION
Reel/Frame 059262/0105 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; ATMEL CORPORATION
Reel/Frame 050987/0430 →
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; ATMEL CORPORATION
Reel/Frame 050986/0798 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2019
From: ATMEL CORPORATION
To: BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 050950/0594 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: ATMEL CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041715/0747 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT COLLATERAL Recorded Apr 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: ATMEL CORPORATION
Reel/Frame 038376/0001 →
PATENT SECURITY AGREEMENT Recorded Jan 3, 2014
From: ATMEL CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC. AS ADMINISTRATIVE AGENT
Reel/Frame 031912/0173 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 22, 2011
From: QRG LIMITED
To: ATMEL CORPORATION
Reel/Frame 026503/0789 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2011
From: YILMAZ, ESAT
To: QRG LIMITED
Reel/Frame 026337/0969 →
Continuity (1)
Related Publication 20120299863A1 · Nov 29, 2012