Electronic component including micro balls
A system of micro balls is disclosed for coupling an electronic component to a printed circuit board. The micro balls have a small diameter, and each contact pad may include an array of two or more micro balls. An example of a micro ball may include a polymer core, surrounded by a copper layer, which is in turn surrounded by a layer of solder.
1. An electronic component, comprising:
a substrate including one or more contact pads; and
a plurality of balls of composite material, arranged in a non-linear grouping on one contact pad of the one or more contact pads, for physically and electrically coupling the electronic component to a printed circuit board, the plurality of balls remaining separate from each other on the one contact pad after reflow.
2. The electronic component of claim 1 , wherein the plurality of balls of composite material each comprises a core formed of a polymer.
3. The electronic component of claim 2 , wherein the plurality of balls of composite material each comprises a copper layer formed around the polymer core.
4. The electronic component of claim 3 , wherein the plurality of balls of composite material each comprises a layer of solder around the copper layer.
5. The electronic component of claim 1 , wherein the plurality of balls of composite material comprises two balls of composite material.
6. The electronic component of claim 1 , wherein the plurality of balls of composite material comprises three balls of composite material.
7. The electronic component of claim 1 , wherein the plurality of balls of composite material comprises four balls of composite material.
8. The electronic component of claim 1 , wherein the plurality of balls of composite material comprises five balls of composite material.
9. The electronic component of claim 1 , wherein the electronic component is flash memory semiconductor package.
10. The electronic component of claim 1 , wherein the electronic component is a BGA package.
11. A ball grid array package, comprising:
a substrate including one or more contact pads; and
a plurality of micro balls arranged in a non-linear grouping on one contact pad of the one or more contact pads for physically and electrically coupling the ball grid array package to a printed circuit board, wherein the micro balls are separate from each other before and after reflow.
12. The ball grid array package of claim 11 , wherein the plurality of micro balls each has a diameter between 0.05 and 0.25 mm.
13. The ball grid array package of claim 11 , wherein the plurality of micro balls each has a diameter between 0.05 and 0.15 mm.
14. The ball grid array package of claim 11 , wherein the plurality of micro balls each comprises a polymer core solder ball.
15. The ball grid array package of claim 11 , wherein the plurality of micro balls comprises two to five balls of composite material.
16. An electronic system, comprising:
a printed circuit board; and
a ball grid array package, including:
a substrate including one or more contact pads; and
a plurality of reflowed micro balls arranged in a non-linear grouping on one contact pad of the one or more contact pads physically and electrically coupling the ball grid array package to a printed circuit board.
17. The electronic system of claim 16 , the plurality of micro balls each having a diameter between 0.05 and 0.25 mm before coupling to the printed circuit board.
18. The electronic system of claim 16 , the plurality of micro balls each having a diameter of 0.1 mm before coupling to the printed circuit board.
19. The electronic system of claim 16 , the plurality of micro balls each having a diameter of 0.02 mm after a coupling to the printed circuit board.
20. The electronic system of claim 16 , three or more micro balls of the plurality of micro balls defining a plane, the printed circuit board coupled to the plane defined by the three or more micro balls.