System-in-a-package based flash memory card
View Patent ↗A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.
1. A method of forming an integrated circuit for a flash memory, the flash memory including one or more external lids, the method comprising the steps of:
(a) mounting a plurality of integrated circuit components on a substrate;
(b) encapsulating the plurality of integrated circuit components in a molding compound;
(c) cutting the encapsulated integrated circuit to include a notch, the notch cut to conform in shape to a notch in the one or more external lids, and cutting the encapsulated integrated circuit to include a chamfer, the chamfer cut to conform in shape to a chamfer in the one or more external lids, wherein the notch and chamfer are cut in corners of the encapsulated integrated circuit.
2. A method as recited in claim 1 , wherein the notch and chamfer are cut in diametrically opposed corners of the encapsulated integrated circuit.
3. A method as recited in claim 1 , said step (c) comprising the step of cutting the encapsulated integrated circuit to fit within one or more lids of an SD Card.
4. A method of forming a flash memory, the method comprising the steps of:
(a) mounting a plurality of integrated circuit components on a substrate;
(b) encapsulating the plurality of integrated circuit components in a molding compound;
(c) cutting the encapsulated integrated circuit to include a notch and a chamfer, wherein the notch and chamfer are cut in corners of the encapsulated integrated circuit; and
(d) encasing the encapsulated integrated circuit within one or more external lids, the one or more external lids including a notch for receiving a reciprocating switch, wherein the notch cut in said step (c) removes a portion of the molding compound that would otherwise interfere with reciprocation of the switch in the notch in the one or more external lids.
5. A method as recited in claim 4 , further comprising the step of forming the one or more external lids with a chamfer.
6. A method as recited in claim 5 , the step of cutting the chamfer in the encapsulated integrated circuit comprising the step of cutting the chamfer in the encapsulated integrated circuit to align with the chamfer cut in the one or more external lids.
7. A method as recited in claim 4 , wherein the notch and chamfer are cut in diametrically opposed corners of the encapsulated integrated circuit.
8. A method as recited in claim 4 , said steps (a) through (d) comprising the step of forming a system-in-a-package.
9. A method as recited in claim 4 , said steps (a) through (d) comprising the step of forming an SD Card.