Semiconductor device having a simplified stack and method for manufacturing thereof
View Patent ↗Embodiments of the present invention are directed to provide a semiconductor device including a semiconductor chip formed of a conductive material, a connector terminal around the semiconductor chip, which is formed of a same material for forming the semiconductor chip, an insulating member for electrically insulating the semiconductor chip from the connector terminal, and a first connection member for electrically coupling the semiconductor chip with the connector terminal. Simplified step of manufacturing the connector terminal may further simplify the steps of manufacturing the semiconductor device.
1. A method for manufacturing a semiconductor device comprising:
forming, in a semiconductor wafer comprising a first region and a second region, a portion of the second region into a plurality of connector terminals;
electrically insulating the first region from the plurality of connector terminals; and
electrically coupling the first region with the plurality of connector terminals,
wherein the first region is formed into a semiconductor chip and the second region is disposed around the first region and is formed into said connector terminals wherein said semiconductor chip and said connector terminals are formed of the same material.
2. The method according to claim 1 , wherein the semiconductor wafer comprises a conductive material.
3. The method according to claim 1 , wherein forming the portion of the second region into a plurality of connector terminals comprises forming a groove between the first region and the second region of the semiconductor wafer such that the first region and the second region are not directly in contact with each other.
4. The method for manufacturing a semiconductor device according to claim 1 , wherein electrically insulating the first region from the connector terminal comprises filling the groove with an insulating member.
5. The method for manufacturing a semiconductor device according to claim 4 , wherein electrically insulating the first region from the connector terminal further comprises coating side surfaces of the semiconductor chip and the connector terminal with the insulating member.