IP Library Granted Patent US 9,071,249
Granted Patent B2
US 9,071,249 · App. 13/348,274 · Granted Jun 30, 2015

Corrosion resistant touch sensor

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Quick Facts
Patent No.
US 9,071,249
App. No.
13/348,274
Granted
Jun 30, 2015
Kind
B2
Abstract

In one embodiment, a touch sensor includes a substrate. A plurality of conductive elements are formed on the substrate. A plurality of sacrificial conductive members overlay portions of the plurality of conductive elements. The sacrificial conductive members function as sacrificial anodes for the conductive elements.

Claims (38)

1. A touch sensor comprising:

a substrate;

a plurality of conductive elements formed on the substrate; and

a plurality of sacrificial conductive members, each sacrificial conductive member of at least a subset of the plurality of sacrificial conductive members overlaying at least a portion of one or more conductive elements of the plurality of conductive elements, each sacrificial conductive member of the subset functioning as a sacrificial anode for at least one of the plurality of conductive elements, wherein

the plurality of conductive elements include a plurality of tracks that couple a plurality of connection pads to a plurality of electrodes of the touch sensor; and

the plurality of sacrificial conductive members overlay a plurality of first segments of the plurality of tracks, each first segment of a track disposed between a connection pad and an edge of an adhesive layer applied over the substrate and a second segment of the track.

2. The touch sensor of claim 1 , each sacrificial conductive member of the subset having a corrosion resistance that is lower than a corrosion resistance of the at least one conductive element for which the sacrificial conductive member serves as a sacrificial anode.

3. The touch sensor of claim 1 , each sacrificial conductive member of the subset formed of zinc or a zinc based material and the plurality of conductive elements formed of a plurality of fine lines of a metal other than zinc.

4. The touch sensor of claim 1 , each sacrificial conductive member of the subset formed of zinc or a zinc based material and the plurality of conductive elements formed of copper or a copper based material.

5. The touch sensor of claim 1 , at least one of the plurality of conductive elements comprising a drive electrode or a sense electrode of the touch sensor that is at least partially overlaid by a corresponding sacrificial conductive member.

6. The touch sensor of claim 1 , at least one of the plurality of conductive elements comprising a portion of a track of the touch sensor that is at least partially overlaid by a corresponding sacrificial conductive member.

7. The touch sensor of claim 1 , at least one of the plurality of conductive elements comprising a connection pad of a plurality of connection pads of the touch sensor, the connection pad overlaid by a corresponding sacrificial conductive member, each connection pad configured to couple one or more drive lines, sense lines, or ground lines of the touch sensor to a touch-sensor controller comprising one or more computer-readable storage media embodying logic operable when executed to control the touch sensor.

8. The touch sensor of claim 1 , wherein the plurality of connection pads are not overlaid by sacrificial conductive material.

9. The touch sensor of claim 1 , further comprising a layer of optically clear adhesive formed over at least one of the plurality of conductive elements and at least one of the plurality of sacrificial conductive members.

10. The touch sensor of claim 1 , wherein the plurality of sacrificial conductive members are formed by:

applying a layer of a sacrificial conductive material over the plurality of conductive elements formed on the substrate and at least a portion of a surface of the substrate; and

removing particular portions of the layer of sacrificial conductive material.

11. A device comprising:

a touch sensor comprising:

a substantially transparent substrate;

a plurality of conductive elements formed on the substantially transparent substrate, the conductive elements comprising fine lines of metal;

a plurality of sacrificial conductive members, each sacrificial conductive member of at least a subset of the plurality of sacrificial conductive members overlaying at least a portion of one or more conductive elements of the plurality of conductive elements, each sacrificial conductive member of the subset functioning as a sacrificial anode for at least one of the plurality of conductive elements;

a touch-sensor controller comprising one or more computer-readable storage media embodying logic that when executed is operable to control the touch sensor; and

an electronic display overlaid by at least a portion of the touch sensor; wherein

the plurality of conductive elements include a plurality of tracks that couple a plurality of connection pads to a plurality of electrodes of the touch sensor; and

the plurality of sacrificial conductive members overlay a plurality of first segments of the plurality of tracks, each first segment of a track disposed between a connection pad and an edge of an adhesive layer applied over the substrate and a second segment of the track.

12. The device of claim 11 , each sacrificial conductive member of the subset having a corrosion resistance that is lower than a corrosion resistance of the at least one conductive element for which the sacrificial conductive member serves as the sacrificial anode.

13. The device of claim 11 , each sacrificial conductive member of the subset formed of zinc or a zinc based material.

14. The device of claim 11 , at least one of the plurality of conductive elements comprising a connection pad of a plurality of connection pads of the touch sensor, the connection pad overlaid by a corresponding sacrificial conductive member, each connection pad configured to couple one or more drive lines, sense lines, or ground lines of the touch sensor to the touch-sensor controller comprising one or more computer-readable storage media embodying logic operable when executed to control the touch sensor.

15. The device of claim 11 , wherein the plurality of connection pads are not overlaid by sacrificial conductive material.

16. The device of claim 11 , wherein the plurality of sacrificial conductive members are formed by:

applying a layer of a sacrificial conductive material over the plurality of conductive elements formed on the substantially transparent substrate and at least a portion of a surface of the substantially transparent substrate; and

removing particular portions of the layer of sacrificial conductive material.

17. A touch sensor comprising:

a substrate;

a plurality of conductive elements formed on the substrate;

a plurality of sacrificial conductive members, each sacrificial conductive member of at least a subset of the plurality of sacrificial conductive members overlaying at least a portion of one or more conductive elements of the plurality of conductive elements, each sacrificial conductive member of the subset functioning as a sacrificial anode for at least one of the plurality of conductive elements; and

the plurality of sacrificial conductive members comprising sacrificial material placed at the end of a plurality of drive or sense lines of the touch sensor, each drive line coupled to a plurality of drive electrodes, each sense line coupled to a plurality of sense electrodes.

Assignments (13)
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: ATMEL CORPORATION
Reel/Frame 059262/0105 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; ATMEL CORPORATION
Reel/Frame 050987/0430 →
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; ATMEL CORPORATION
Reel/Frame 050986/0798 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2019
From: ATMEL CORPORATION
To: BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 050950/0594 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: ATMEL CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041715/0747 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT COLLATERAL Recorded Apr 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: ATMEL CORPORATION
Reel/Frame 038376/0001 →
PATENT SECURITY AGREEMENT Recorded Jan 3, 2014
From: ATMEL CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC. AS ADMINISTRATIVE AGENT
Reel/Frame 031912/0173 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 9, 2012
From: ATMEL TECHNOLOGIES U.K. LIMITED
To: ATMEL CORPORATION
Reel/Frame 027676/0487 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 11, 2012
From: GUARD, DAVID BRENT
To: ATMEL TECHNOLOGIES U.K. LIMITED
Reel/Frame 027517/0366 →