IP Library Granted Patent US 9,160,332
Granted Patent B2
US 9,160,332 · App. 13/367,511 · Granted Oct 13, 2015

Method and system for mechanical coupling of flexible printed circuit to a sensor

Inventor: David Brent Guard (Hampshire, GB)
Assignee: Atmel Corporation
H03K17/9622G06F3/044H01R43/0256H03K2217/96023H03K2217/96031H03K2217/960755
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Quick Facts
Patent No.
US 9,160,332
App. No.
13/367,511
Granted
Oct 13, 2015
Kind
B2
Abstract

In one embodiment, a system includes a touch sensor comprising a set of electrodes and a set of one or more connection pads electrically coupled to the set of electrodes. The system also includes a circuit electrically coupled to the one or more connection pads such that signals may be communicated from the set of one or more connection pads to the circuit. The system further includes the circuit mechanically coupled to the touch sensor via friction welding.

Claims (43)

1. A system comprising:

a touch sensor operable to determine a position of a touch within a touch-sensitive area of the touch sensor, the touch sensor comprising:

a non-touch-sensitive portion located along one or more edges of the touch sensor;

a first set of electrodes; and

a first set of one or more connection pads electrically coupled to the first set of electrodes and located on a first side of the touch sensor in the non-touch-sensitive portion; and

a circuit comprising a second set of one or more connection pads located on a first side of the circuit, wherein the circuit is:

a flexible printed circuit;

electrically coupled to the first set of one or more connection pads such that signals may be communicated from the first set of one or more connection pads to the circuit; and

mechanically coupled to the touch sensor via friction welding, wherein the mechanical coupling couples a portion of the first side of the touch sensor located between the first set of connection pads in the non-touch-sensitive portion to a portion of the first side of the circuit located between the second set of connection pads.

2. The system of claim 1 further comprising:

a second set of electrodes, the touch sensor comprising the second set of electrodes; and

a third set of one or more connection pads electrically coupled to the second set of electrodes and electrically coupled to the circuit.

3. The system of claim 2 , wherein:

the first set of electrodes and the first set of one or more connection pads are located on the first side of the touch sensor; and

the second set of electrodes and the third set of one or more connection pads are located on a second side of the touch sensor, the first side of the touch sensor and the second side of the touch sensor being located on different sides of a same substrate.

4. The system of claim 2 , wherein:

the first set of electrodes are arranged along a first axis; and

the second set of electrodes are arranged along a second axis, the first and second axes being substantially perpendicular to each other.

5. The system of claim 1 , wherein one or more portions of the first set of electrodes comprises indium tin oxide (ITO).

6. The system of claim 1 , wherein the circuit is mechanically coupled to the touch sensor via friction welding at portions of the touch sensor not having any connection pads, electrodes, and traces coupled thereto.

7. The system of claim 1 , further comprising a cover coupled to the touch sensor via an adhesive.

8. The system of claim 7 , further comprising the cover coupled to the circuit via friction welding.

9. The system of claim 7 , further comprising a rear protective substrate coupled to the touch sensor via a second adhesive and to the circuit via friction welding.

10. The system of claim 1 , the circuit mechanically coupled to the touch sensor via friction welding at optically opaque portions of the touch sensor.

11. A method comprising:

electrically coupling a first set of one or more connection pads to a first set of electrodes, a touch sensor comprising the first set of electrodes and the first set of one or more connection pads, the first set of one or more connection pads located on a first side of the touch sensor in non-touch-sensitive portion along one or more edges of the touch sensor;

electrically coupling a circuit to the first set of one or more connection pads such that signals may be communicated from the first set of one or more connection pads to the circuit;

mechanically coupling the circuit to the touch sensor via friction welding; and

wherein:

the circuit is a flexible printed circuit;

the circuit comprises a second set of one or more connection pads located on a first side of the flexible printed circuit; and

the mechanical coupling couples a portion of the first side of the touch sensor located between the first set of connection pads in the non-touch-sensitive portion to a portion of the first side of the circuit located between the second set of connection pads.

12. The method of claim 11 further comprising:

electrically coupling a third set of one or more connection pads to a second set of electrodes, the touch sensor comprising the second set of electrodes; and

electrically coupling the third set of one or more connection pads to the circuit.

13. The method of claim 12 , wherein:

electrically coupling the first set of one or more connection pads to the first set of electrodes comprises electrically coupling the first set of one or more connection pads to the first set of electrodes such that the first set of electrodes and the first set of one or more connection pads are located on the first side of the touch sensor; and

electrically coupling the third set of one or more connection pads to the second set of electrodes comprises electrically coupling the third set of one or more connection pads to the second set of electrodes such that the second set of electrodes and the third set of one or more connection pads are located on a second side of the touch sensor, the first side of the touch sensor and the second side of the touch sensor being located on different sides of a same substrate.

14. The method of claim 11 , wherein mechanically coupling the circuit to the touch sensor via friction welding comprising mechanically coupling the circuit to the touch sensor via friction welding at portions of the touch sensor not having any connection pads, electrodes, and traces coupled thereto.

15. The method of claim 11 , further comprising mechanically coupling a cover to the touch sensor via an adhesive.

16. The method of claim 15 , further comprising mechanically coupling the cover to the circuit via friction welding.

17. The method of claim 15 , further comprising mechanically coupling a protective substrate to the touch sensor via a second adhesive and to the circuit via friction welding.

18. The method of claim 11 , wherein mechanically coupling the circuit to the touch sensor via friction welding comprises mechanically coupling the circuit to the touch sensor at optically opaque portions of the touch sensor.

Assignments (13)
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: ATMEL CORPORATION
Reel/Frame 059262/0105 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; ATMEL CORPORATION
Reel/Frame 050987/0430 →
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; ATMEL CORPORATION
Reel/Frame 050986/0798 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2019
From: ATMEL CORPORATION
To: BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 050950/0594 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: ATMEL CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041715/0747 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT COLLATERAL Recorded Apr 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: ATMEL CORPORATION
Reel/Frame 038376/0001 →
PATENT SECURITY AGREEMENT Recorded Jan 3, 2014
From: ATMEL CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC. AS ADMINISTRATIVE AGENT
Reel/Frame 031912/0173 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 21, 2012
From: ATMEL TECHNOLOGIES U.K. LIMITED
To: ATMEL CORPORATION
Reel/Frame 027903/0267 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 7, 2012
From: GUARD, DAVID BRENT
To: ATMEL TECHNOLOGIES U.K. LIMITED
Reel/Frame 027663/0851 →
Continuity (1)
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